Chalcogenide lens elements and methods of manufacturing such lens elements are provided. In one example, a method includes depositing a first chalcogenide layer on a substrate. The method further includes applying a first stamp to the first chalcogenide layer. The method further includes reflowing, in response to applying the first stamp, the first chalcogenide layer to form a first shaped chalcogenide layer. The method may further include singulating the substrate and the first shaped chalcogenide layer to obtain a plurality of chalcogenide lens elements.

Fabricating light guide elements includes forming a first portion of the light guide element using a replication technique (104), and forming a second portion of the light guide element using a photolithographic technique (106). Use of replication can facilitate formation of more complex-shaped optical elements as part of the light guide element. The replication process sometimes results in the formation of a “yard,” or excess replication material, which may lead to light leakage if not removed or smoothed over. In some instances, at least part of the yard portion is embedded within the second portion of the light guide element, thereby resulting in a smoothing over of the yard portion.

A method of making optical diffuser elements (20) includes providing a substrate (100) composed of a polymer material and having openings (102) therein. An optical diffuser material (110) is dispensed into the openings (102), and the optical diffuser material (110) is hardened to form a sheet (200) composed of regions of the optical diffuser material (110) surrounded laterally by the polymer material. The method includes separating the sheet (200) into multiple optical diffuser elements (30) that retain their mechanical stability and optical properties when subjected to a reflow process.

A method of manufacturing a chip scale light-emitting diode package is provided. The method of manufacturing chip scale light-emitting diode package includes: manufacturing a lens molding sheet including intaglios on one surface thereof; forming a lens layer having lens portions on one surface thereof and a flat surface on a surface opposite thereto by applying a light-transmitting resin to the intaglios; forming an adhesive layer on the flat surface of the lens layer; arranging light-emitting diode chips, each having a first surface and a second surface opposite to the first surface, on the adhesive layer in such a way that the light-emitting diode chips correspond to the lens portions and the second surface is attached to the adhesive layer, wherein a first electrode pad and a second electrode pad are formed on the first surface; and manufacturing a chip array sheet by forming a molding part on the adhesive layer to cover outer surfaces of the light-emitting diode chips.

To suppress occurrence of contamination or damage to a lens. In the present technology, for example, a manufacturing apparatus allows a spacer which is thicker than a height of a lens resin portion protruded from a substrate to be adhered to the substrate. In addition, for example, in the present technology, the manufacturing apparatus molds the lens resin portion inside a through-hole formed in the substrate by using a mold frame configured with two layers of molds and, after molding the lens resin portion, in the state that one mold is adhered to the substrate, the manufacturing apparatus demolds the substrate from the other mold. The present technology can be applied to, for example, a lens-attached substrate, a stacked lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic apparatus, a computer, a program, a storage medium, a system, or the like.

A manufacturing method of an optical unit for endoscope includes: a process of crimping a bonding sheet including a curable resin film to a release substrate having a release surface which is an optical flat surface; a mirror-finishing process of performing a partial curing treatment on a predetermined region of the bonding sheet to process the predetermined region into an optical flat surface; a process of fabricating a laminated wafer by laminating a first element wafer including a first optical element and a second element wafer including a second optical element, with the bonding sheet being arranged between the first element wafer and the second element wafer; a curing process of performing a curing treatment on an uncured region of the bonding sheet; and a process of cutting the laminated wafer and segmenting the laminated wafer into optical units.

An optics wafer includes replicated optical elements such as lenses that can be formed without the use of a separate glass or other substrate on which the optical elements would otherwise need to be replicated or mounted.

Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

Provided is a curable composition which has excellent curability, less causes silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition according to the present invention is a curable composition for production of an optical component by molding using silicone molds. The curable composition contains curable compounds and a cationic initiator. The curable compounds include (A) a cycloaliphatic epoxy compound and (B) an oxetane compound. The oxetane compound (B) is present in a content of 10 to 45 weight percent of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 90 weight percent or more is a compound or compounds having a solubility parameter of 9.0 (cal/cm.sup.3).sup.½ or more as determined at 25° C. by the Fedors' method.

A wafer lens array includes a wafer lens formed by arranging a plurality of plate members on a plane, each plate member including a first window configured to allow light for forming an optical image to pass through, a first light-shielding portion formed on an outer circumference of the first window and a second window formed on an outer circumferential side of the first light-shielding portion and configured to allow illumination light to pass through, and the wafer lens in plurality are coaxially layered and the layered wafer lenses are bonded and fixed together in a region of the second window.