An optics wafer includes replicated optical elements such as lenses that can be formed without the use of a separate glass or other substrate on which the optical elements would otherwise need to be replicated or mounted.

A method includes applying a polymer to a mold, the mold having microstructures with the polymer flowing into the microstructures when applied to the mold. The method includes pressing an inorganic substrate onto the polymer. The method includes curing the polymer to fix the polymer to the inorganic substrate to form an optical element from the polymer and the inorganic substrate, the optical element having microstructures formed by the microstructures in the mold. The method includes releasing the optical element from the mold.

A deformation of a stacked lens is suppressed.

A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

Provided is a laminated lens structure capable of corresponding various optical parameters. The laminated lens structure includes at least one or more sheets of first lens-attached substrates and at least one or more sheets of second lens-attached substrates as a lens-attached substrate including a lens resin portion that forms a lens, and a carrier substrate that carries the lens resin portion. The carrier substrate of the first lens-attached substrates is constituted by laminating a plurality of sheets of carrier configuration substrates in a thickness direction, and the carrier substrate of the second lens-attached substrates is constituted by one sheet of carrier configuration substrate. For example, the present technology is applicable to a camera module and the like.

A molding device for lens array is disclosed and for pressing a plurality of lenses onto a plate structure, the plate structure comprising a plate body having a thickness T1 and a plurality of through holes disposed in the plate body. The molding device includes an upper mold and a lower mold. The upper mold has a plurality of upper mold pressing regions and a plurality of upper mold cavities, and the lower mold has a plurality of lower mold pressing regions and lower mold cavities. The plate structure is movably disposed between the upper mold and the lower mold, the plurality of pre-manufactured lenses are respectively disposed in the plurality of through holes of the plate structure for manufacturing.

A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

A method includes depositing a surface modification layer on sidewalls of a plurality of cavities of a shaped article. The surface modification layer is formed from a glass material including a mobile component. The shaped article is formed from a glass material, a glass ceramic material, or a combination thereof. At least a portion of the mobile component is migrated from the surface modification layer into surface regions of the sidewalls of the shaped article, whereby subsequent to the migration, the surface regions have a reduced annealing point compared to a bulk of the shaped article. The surface modification layer and the surface regions of the sidewalls are reflowed. A surface roughness of the surface modification layer disposed on the sidewalls following the reflowing is less than a surface roughness of the sidewalls prior to the depositing.

A lens member for an LED lighting fixture having a plurality of LED dies mounted on a substrate includes a planar frame having a plurality of apertures and an optically transparent silicone rubber overmolded on a first side of the frame. The overmolded silicone rubber defines a plurality of optical elements. Each optical element is disposed within one of the apertures and is shaped to focus or redirect light transmitted through the optical element.

A positional shift of a lens of a stacked lens structure is reduced. A plurality of through-holes is formed at a position shifted from a first target position on a substrate according to a first shift. A lens is formed on an inner side of each of the through-holes using a first mold in which a plurality of first transfer surfaces is disposed at a position shifted from a predetermined second target position according to a second shift and a second mold in which a plurality of second transfer surfaces is disposed at a position shifted from a predetermined third target position according to a third shift. The plurality of substrates having the lenses formed therein is formed according to direct bonding, and the plurality of stacked substrates is divided. The present technique can be applied to a stacked lens structure or the like, for example.

Influence of chipping in case of dicing a plurality of stacked substrates is reduced. Provided is a semiconductor device where a substrate, in which a groove surrounding a pattern configured with a predetermined circuit or part is formed, is stacked. The present technology can be applied to, for example, a stacked lens structure where through-holes are formed in each substrate and lenses are disposed in inner sides of the through-holes, a camera module where a stacked lens structure and a light-receiving device are incorporated, a solid-state imaging device where a pixel substrate and a control substrate are stacked, and the like.