Patent classifications
B29K2105/18
Reducing CNT resistivity by aligning CNT particles in films
A method for reducing the resistivity of a thermoplastic film containing carbon nanotubes includes connecting an electric power supply to the thermoplastic film containing carbon nanotubes and passing electric current through the thermoplastic film containing carbon nanotubes to heat the thermoplastic film to an elevated temperature and align carbon nanotubes within the thermoplastic film. The thermoplastic film is solid at room temperature.
Metallic resin molding of annular components without visible knit line
A core mold component defining a lower surface of the injection mold set corresponding to the lower surface of the annular component is heated to a base temperature. A cavity mold component defining the upper surface of the injection mold set corresponding to the Class A surface of the annular component is heated to a higher temperature than the base temperature. Faces of two streams of metallic resin, including the metallic resin flakes, injected into the mold set are caused to come together at the knit line. Metallic resin flakes are caused to flow into inboard and outboard overflow cavity through respective inboard and outboard gates positioned adjacent the knit line.
Forming a three dimensional object
Disclosed are methods and apparatus for selectively sintering particulate material, the method comprising: providing a layer (6) of particulate material; providing an amount of a radiation absorbent material over a selected surface portion of the layer (6) of particulate material; providing an amount of a material that comprises a plurality of electrically conductive elements (20) over at least part of the selected surface portion of the layer (6) of particulate material; and providing radiation (8) across the selected surface portion of the layer of particulate material so as to sinter a portion of the material of the layer (6) including causing the plurality of electrically conductive elements (20) to become embedded in the sintered portion of material.
Method for packing filler material
A method for filling a gap with a filler material, enabling prevention of inflow of the filler material into an air removing tool through its opening before complete removal of air from the gap, and enabling uniform filling of the gap with the filler material. The gap is between an existing conduit and a lining material provided inside the existing conduit. The method includes: inserting an air removing tool into an air removing hole bored through the lining material, and bringing a leading end face of the air removing tool into contact with the inner circumferential surface of the existing conduit; and injecting the filler material into the gap while expelling air from the gap through a leading end of the air removing tool, the air removing tool including, at its leading end, an air removing portion through which air is discharged.
Method for the production of a fiber composite component, and semifinished textile product therefor
A method for manufacturing a fiber composite component includes providing a semi-finished textile product; injecting a matrix material into the semi-finished textile product so as to form an infiltrated semi-finished product, wherein the matrix material includes a thermoplastic film having particles dispersed therein; and curing the infiltrated semi-finished product.
BONDED PERMANENT MAGNETS PRODUCED BY ADDITIVE MANUFACTURING
A method for producing a bonded permanent magnet by additive manufacturing, the method comprising: (i) incorporating components of a reactive precursor material into an additive manufacturing device, the reactive precursor material comprising an amine component, an isocyanate component, and particles having a permanent magnetic composition; and (ii) mixing and extruding the crosslinkable reactive precursor material through a nozzle of the additive manufacturing device and depositing the extrudate onto a substrate under conditions where the extrudate is permitted to cure, to produce a bonded permanent magnet of desired shape. The resulting bonded permanent magnet and articles made thereof are also described.
REDUCING CNT RESISTIVITY BY ALIGNING CNT PARTICLES IN FILMS
A method for reducing the resistivity of a thermoplastic film containing carbon nanotubes includes connecting an electric power supply to the thermoplastic film containing carbon nanotubes and passing electric current through the thermoplastic film containing carbon nanotubes to heat the thermoplastic film to an elevated temperature and align carbon nanotubes within the thermoplastic film. The thermoplastic film is solid at room temperature.
Shape memory thermal interface materials
A shape memory polymer thermal interface material (SMP TIM) pad may be deformed to a deformed SMP TIM pad. The deformed SMP TIM pad may be mated to a first surface of a computing chip. A heat dissipating structure may be mated to the deformed SMP TIM pad opposite of the first surface of the computing chip. A loading force may be applied to the SMP TIM pad. The deformed SMP TIM pad may be heated to a reformation temperature. The heat dissipating structure may be fastened to the computing chip using one or more fasteners.
METALLIC RESIN MOLDING OF ANNULAR COMPONENTS WITHOUT VISIBLE KNIT LINE
A core mold component defining a lower surface of the injection mold set corresponding to the lower surface of the annular component is heated to a base temperature. A cavity mold component defining the upper surface of the injection mold set corresponding to the Class A surface of the annular component is heated to a higher temperature than the base temperature. Faces of two streams of metallic resin, including the metallic resin flakes, injected into the mold set are caused to come together at the knit line. Metallic resin flakes are caused to flow into inboard and outboard overflow cavity through respective inboard and outboard gates positioned adjacent the knit line.
SHAPE MEMORY THERMAL INTERFACE MATERIALS
A shape memory polymer thermal interface material (SMP TIM) pad may be deformed to a deformed SMP TIM pad. The deformed SMP TIM pad may be mated to a first surface of a computing chip. A heat dissipating structure may be mated to the deformed SMP TIM pad opposite of the first surface of the computing chip. A loading force may be applied to the SMP TIM pad. The deformed SMP TIM pad may be heated to a reformation temperature. The heat dissipating structure may be fastened to the computing chip using one or more fasteners.