A laminate including a first base material layer, a second base material layer, and a sealant layer in this order, wherein all three layers include a polyolefin film; the polyolefin film of the first base material layer or the second base material layer includes an inorganic oxide layer on at least one surface thereof; and each of the first base material layer, the second base material layer, and the sealant layer has a heat shrinkage rate, in a travel direction after heating at 120 C. for 15 minutes, which satisfies the following inequalities: heat shrinkage rate of the second base material layer5% (Inequality 1); heat shrinkage rate of the second base material layerheat shrinkage rate of the first base material layer (Inequality 2); and, heat shrinkage rate of the second base material layerheat shrinkage rate of the sealant layer (Inequality 3).ws

A method for fabricating a metallized assembly for a microcircuit card exhibiting a metallized effect, the assembly forming an internal layer of the card. The method comprises providing a support layer formed of a plastic material sensitive to heat exhibiting a first shrinkage ratio, the support layer having, on a surface, at least the dimensions of a microcircuit card, providing a metallized film held on a first non-adhesive bearing liner, the first non-adhesive bearing liner exhibiting a shrinkage ratio less than that of the support layer, transferring the metallized film onto the support layer by applying heat and pressure, and removing the first non-adhesive bearing liner. Also provided are a method for fabricating a microcircuit card and a microcircuit card obtained by this method.

A method for fabricating a metallized assembly for a microcircuit card exhibiting a metallized effect, the assembly forming an internal layer of the card. The method comprises providing a support layer formed of a plastic material sensitive to heat exhibiting a first shrinkage ratio, the support layer having, on a surface, at least the dimensions of a microcircuit card, providing a metallized film held on a first non-adhesive bearing liner, the first non-adhesive bearing liner exhibiting a shrinkage ratio less than that of the support layer, transferring the metallized film onto the support layer by applying heat and pressure, and removing the first non-adhesive bearing liner. Also provided are a method for fabricating a microcircuit card and a microcircuit card obtained by this method.