Contact pins for glass seals is provided having an iron alloy and a method for their production. The contact pins are provided with a nickel layer and coated with rhodium and/or platinum or with palladium. The contact pins may be additionally provided with a layer of gold. The contact pins are first cleaned by degreasing and activating, preferably by activating through acid etching. Thereafter, the application of a nickel layer is performed under a protective gas atmosphere, followed by formatting at 850 to 1050° C. The protective gas atmosphere is preferably made up of 10 to 100% hydrogen, with the balance formed of nitrogen. This is followed by a coating with palladium or with rhodium and platinum, or with platinum, or with rhodium and gold.

A Ni-plated steel sheet according to an aspect of the present invention includes: a base steel sheet; an Fe—Ni diffusion alloy region disposed on the base steel sheet; and a Ni plating region disposed on the Fe—Ni diffusion alloy region, in which an average equivalent circle diameter of crystal grains made of Ni (fcc) in the Ni plating region measured in a cross section perpendicular to a rolled surface of the base steel sheet is 0.2 to 4.0 μm.

An apparatus includes first, second, and third layers. The first layer includes a plurality of flanges. The second layer includes a deformable membrane. The second layer is connected to the first layer along a first major surface of the deformable membrane. The third layer is connected to the second layer along a second major surface of the deformable membrane opposite the first major surface. The third layer includes a first series of internal structures.

Provided is an article of cookware and a method of making the same. The cookware has at least one stainless steel layer and at least one copper layer metallurgically bonded directly to the at least one stainless steel layer via solid state bonding. The at least one stainless steel layer may be a ferritic stainless steel layer, and the at least one copper layer may be a grain stabilized copper. The at least one stainless steel layer may be made from a 400 series stainless steel, such as a 436 stainless steel alloy, a 439 stainless steel alloy, or a 444 stainless steel alloy. The at least one copper layer may be made from a high purity, oxygen free copper alloy, such as a C101 copper alloy, a C102 copper alloy, or a C107 copper alloy.

This invention provides a metal laminate that maintains functionality such as radiation performance and is excellent in dimensional accuracy after press work. Such metal laminate is a roll-bonded laminate composed of 2 or more metal layers, which exhibits a ratio σ/T of the standard deviation σ of thickness T.sub.1 of the outermost layer to thickness T of the roll-bonded laminate of 0% of 4.0%, the thickness T of 2 mm or less, and the deviation of the thickness T of 4.0% or less.

A surface-finished steel sheet, in some examples cold-rolled thin steel sheet, includes a metallic corrosion-resistant layer that may comprise more than 40% by weight aluminum and iron. So that that corrosion-resistant layer has high formability, especially cold formability, and hence significantly improved adhesion on forming, the corrosion-resistant layer may comprises nickel, wherein nickel-containing phases are located at a transition from the corrosion-resistant layer to a base material of the steel sheet. The nickel content of the corrosion resistant layer may be in a range from 5 to 30% by weight. Further, a method for producing a surface-finished steel sheet of this kind is also disclosed. In some examples, a nickel layer may be applied to a steel sheet, preferably cold-rolled thin steel sheet in the form of flat steel product, prior to hot-dip coating the steel sheet with a liquid aluminum melt or with a liquid melt of aluminum-based alloy.

Articles including a layer comprising nickel and chromium as well as related methods are described herein.

A steel sheet for electroplating includes, by mass %, C: 0.0005% to 0.0050%, Si: 0.20% to 1.0%, Mn: 0.40% to 2.5%, P: 0.05% or less, Ti: 0.010% to 0.050%, Nb: 0.010% to 0.040%, B: 0.0005% to 0.0030%, S: 0.02% or less, Al: 0.01% to 0.30%, N: 0.0010% to 0.01%, and the balance including Fe and impurities, in which when Si content is represented by [Si] and Mn content is represented by [Mn], “[Mn]+5[Si]” is 2.0 to 7.0, and the steel sheet has surface property in which an average of displacements of a measurement point obtained based on a moving average of continuous 31 points in total including 15 front points and 15 back points in a cross-sectional profile of a surface obtained by measuring the average of displacements in an evaluation length of 10 μm or more at an interval of 0.07 μm, is 0.005 μm to 0.10 μm.

A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

A wiring board and a method for manufacturing the wiring board in which an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted. Copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect.