The invention relates to multilayer materials for producing packaging comprising at least two films and also a layer which is printed with a packaging printing ink, said packaging printing ink comprising a certain hyperbranched polyester containing functional groups. The invention further relates to a packaging printing ink which comprises a certain hyperbranched polyester containing functional groups, and to the use of said printing ink for producing multilayer materials.

The invention relates to multilayer materials for producing packaging comprising at least two films and also a layer which is printed with a packaging printing ink, said packaging printing ink comprising a certain hyperbranched polyester containing functional groups. The invention further relates to a packaging printing ink which comprises a certain hyperbranched polyester containing functional groups, and to the use of said printing ink for producing multilayer materials.

An exterior material to be used for a battery comprises at least one pattern part formed in a transverse direction (TD) of the exterior material, wherein the TD of the exterior material is a width direction of a battery including the exterior material, and a machine direction (MD) of the exterior material is a longitudinal direction of the battery including the exterior material.

A coated metal pipe for use as an automotive fluid transport tube is provided comprising: a single or double walled tubing formed into a circular cross-sectional profile; at least one intermediate layer primer layer applied over said tubing: and an outer layer comprising a polyamide incorporating an immiscible additive. The immiscible additive is selected from Ultra High Molecular Weight (UHMW) silicones, UHMW polyethylene (UHMW-PE), polytetrafluoroethylene (PTFE) and mixtures thereof.

The present invention provides a laminate for blister packs which is not susceptible to molding failures even if a pocket is formed to a certain depth in order to pack the contents of large drug or the like. The present invention provides a laminate for blister packs, the laminate having a substrate film, an adhesive resin layer having a thickness of 25-100 μm, and an absorption film in this order. The absorption film comprises an absorption layer including a thermoplastic resin and an inorganic absorbent.

An object is to provide a substrate for a printed wiring board that has good circuit formability while maintaining adhesion strength between a conductive layer (2) and a base film (1). The substrate includes a base film having an insulating property (1) and a conductive layer (2) formed on at least one surface of the base film (1). The maximum height Sz, which is defined in ISO25178, of the surface of the base film (1) is 0.05 μm or more and less than 0.9 μm.

Provided are a thermoplastic polymer capable of reducing a dielectric dissipation factor in high frequency bands and a film thereof. The thermoplastic liquid crystal polymer includes repeating units represented by the following formulae (I), (II), (III) and (IV), in which a molar ratio of a total amount of the repeating units represented by formulae (I) and (II) to a total amount of all the repeating units in the thermoplastic liquid crystal polymer is 50 to 90 mol %, and a molar ratio of the repeating unit represented by formula (III) to the repeating unit represented by formula (IV) is the former/the latter=23/77 to 77/23.

Provided is a mold release film capable of transferring a concave-convex structure to the surface of an adhesive film.

The present invention relates to a polymer foam laminate structure (1), comprising—a first solid layer (101) having a density of more than 1000 g/l, which is covered by at least one first functional layer (103), —a polymeric foam layer (105) provided on the at least one first functional layer (103), —a second solid layer (109) having a density of more than 1000 g/l, which is covered by at least one second functional layer (107), the at least one second functional layer (107) being in contact with the polymeric foam layer (103), wherein the polymeric foam layer (105) has a density of 20 g/l to less than 1000 g/l. The present invention further pertains a method for preparing a polymer foam laminate structure (1) and a composite component (1000) inter alia comprising the polymer foam laminate structure (1).

A laminate comprises one or more electrically-conductive layers and one or more electrically-insulative layers coupled to the electrically-conductive layer(s). Each of the electrically-conductive layer(s) can comprise at least 90% by weight of copper. Each of the electrically-insulative layer(s) can comprise a layer of polymeric aerogel. For at least one of opposing front and back surfaces of the laminate, at least a portion of the surface is defined by one of the electrically-conductive layer(s).