The present invention relates to a resin film for a flexible printed circuit board consisting of a resin composition containing: a long-chain alkyl bismaleimide resin having a main chain containing an alkylene chain having 10 or more carbon atoms and a side chain containing an alkyl group bonded to the alkylene chain; and a curing agent having two or more functional groups reacting with the long-chain alkyl bismaleimide resin.

A component of a vehicle structure is obtained by a hot forming operation on a hybrid panel having a sheet element of light alloy and a sheet of plastic material. The hybrid panel is hot formed by pressing it against a forming surface of a mould element by a pressurized gas or by a second mould element. Following this operation, the hybrid panel assumes a configuration corresponding to the forming surface, whereas the light alloy sheet element and the plastic material sheet constituting the hybrid panel adhere to each other following softening by heat of the plastic material. Before the hot forming step, a surface of said light alloy sheet element which must contact the plastic material sheet is subjected to a roughening treatment, thereby defining surface asperities between which the plastic material of the plastic material sheet is inserted when it is softened by heat.

Multilayer riblet applique and methods of producing the same are described herein. One disclosed example method includes applying a first high elongation polymer material to a web tool, where the web tool is to be provided from a first roll, and heating, via a first heating process, the first high elongation polymer material. The disclosed example method also includes applying a second high elongation polymer material to the first high elongation polymer material, and heating, via a second heating process, the second high elongation polymer material. The disclosed example method also includes applying, via a laminating roller, a support layer to the second high elongation polymer material.

The present invention relates generally to the field of laminated packaging. In particular, the present invention relates to laminated flexible packaging comprising aluminium and a plastic sealant layer only on one side of the aluminium. One embodiment of the present invention relates to a laminated flexible packaging made at least in part from a laminated flexible packaging material comprising an aluminium foil layer, a plastic sealant layer and a coating, wherein the aluminium foil layer is laminated to the plastic sealant layer on the side facing the packaged product, the other side of the aluminium foil layer is coated with the coating but not laminated to a layer of plastic or paper, and wherein the laminated flexible packaging is manufactured from the laminated flexible packaging material on a horizontal form fill and seal (HFFS) machine.

The present invention relates generally to the field of laminated packaging. In particular, the present invention relates to laminated flexible packaging comprising aluminium and a plastic sealant layer only on one side of the aluminium. One embodiment of the present invention relates to a laminated flexible packaging made at least in part from a laminated flexible packaging material comprising an aluminium foil layer, a plastic sealant layer and a coating, wherein the aluminium foil layer is laminated to the plastic sealant layer on the side facing the packaged product, the other side of the aluminium foil layer is coated with the coating but not laminated to a layer of plastic or paper, and wherein the laminated flexible packaging is manufactured from the laminated flexible packaging material on a horizontal form fill and seal (HFFS) machine.

Novel polyamide-metal laminates which have desirable hydrolysis resistance are provided. The laminates comprise (A) a metal, (B) a tie layer, and (C) a polyamide composition. The tie layer is formed from a composition containing (B1) a polymer containing a comonomer having at least two adjacent carboxylic acid groups and (B2) an amino-silane containing a primary amine and at least one hydroxyl group.

Novel polyamide-metal laminates which have desirable hydrolysis resistance are provided. The laminates comprise (A) a metal, (B) a tie layer, and (C) a polyamide composition. The tie layer is formed from a composition containing (B1) a polymer containing a comonomer having at least two adjacent carboxylic acid groups and (B2) an amino-silane containing a primary amine and at least one hydroxyl group.

Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.

Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.

Provided is a joined body comprising a first joined member, a second joined member, and a joining layer that joins the first joined member and the second joined member, wherein the first joined member and the second joined member are each independently one selected from the group consisting of a metal member, a polyamide resin member, and a polyolefin resin member, and the joining layer is a layer formed of a resin composition having a co-continuous phase including a continuous phase A farmed of the polyamide resin and a continuous phase B formed of the polyolefin resin and has a dispersed domain a distributed in the continuous phase A, a finely dispersed subdomain a′ distributed in the dispersed domain a, a dispersed domain b distributed in the continuous phase B, and a finely dispersed subdomain b′ distributed in the dispersed domain b.