A transparent conductive film includes a metal oxide, a metal, and an epoxy, wherein a refractive index of the metal may be lower than that of the epoxy.

A transparent conductive film includes a metal oxide, a metal, and an epoxy, wherein a refractive index of the metal may be lower than that of the epoxy.

Provided is an electrically activated shape memory polymer composite capable of thermal shape reformation using electric power to heat the composite through its matrix glass transition temperature. The composite includes an adaptable polymer matrix component using a diglycidyl ether resin, at least one substantially well-dispersed conductive or magnetic nano-filler component, and at least one elastic, laminated layer. Also provided are methods of preparing the composite and methods of activating the composite. A shape reformation of the composite is triggered by applying an electric field at DC and/or at a frequency above about 1 μHz for a sufficient time.

Provided is an electrically activated shape memory polymer composite capable of thermal shape reformation using electric power to heat the composite through its matrix glass transition temperature. The composite includes an adaptable polymer matrix component using a diglycidyl ether resin, at least one substantially well-dispersed conductive or magnetic nano-filler component, and at least one elastic, laminated layer. Also provided are methods of preparing the composite and methods of activating the composite. A shape reformation of the composite is triggered by applying an electric field at DC and/or at a frequency above about 1 μHz for a sufficient time.

A metal or composite component assembly includes a first metal or composite component, a second metal or composite component, and an adhesive layer arranged on an interface of the first and second components and bonding the first and second components. The adhesive layer comprises a fast-cure low-strength adhesive and a high-strength structural adhesive.

Provided is an electromagnetic wave shielding material that can exhibit improved electromagnetic wave shielding property, light-weight property and formability. The present invention relates to an electromagnetic wave shielding material comprising a laminate in which N number of metal foils each having a thickness of 5 to 100 μm and N+1 number of resin layers each having a thickness of 5 μm or more are alternately laminated or a laminate in which N+1 number of metal foils each having a thickness of 5 to 100 μm and N number of resin layers each having a thickness of 5 μm or more are alternately laminated, N being an integer of 2 or more, wherein thickness of the laminate is from 100 to 500 μm, and wherein, when a thickness center of the laminate is used as a reference, for all pairs of interfaces at which sequences of the resin layers and the metal foils on both upper and lower sides of the reference correspond to each other, distances from the reference to the interfaces have an error of within ±10%.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

Aluminum alloy foil that, when used for battery packaging material, unlikely to develop pinholes or cracks even during molding of battery packaging material, and can exhibit excellent moldability. Aluminum alloy foil, which is for use in battery packaging material, wherein, with respect to cross section obtained by cutting aluminum alloy foil in vertical direction to rolling direction of aluminum alloy foil, which is a vertical direction to surface of aluminum alloy foil, proportion of total area of a {111} plane in total area of crystal planes of face-centered cubic structure, obtained by performing crystal analysis using EBSD method, is 10% or more; and with respect to cross section, a number average grain diameter R (rpm) of crystals in face-centered cubic structure, obtained by performing crystal analysis using EBSD method, satisfies following equation: number average grain diameter R≤0.056X+2.0, where X=thickness (rpm) of aluminum alloy foil.

A resin composition, a metal-resin composite formed with the resin composition and a metal substrate and a preparation method and use thereof, and an electronic product shell using the resin composition are provided. The resin composition comprises a base resin, a modified resin and a fiber, wherein the base resin is one or two or more of a polyarylene sulfide resin, a polyether resin, and a polyester resin, and the modified resin has a melting point that is 3-24° C. higher than a glass transition temperature of the base resin.

A method for making a conductive pre-impregnated composite sheet includes the steps of joining a nanomaterial composite sheet, a fiber-reinforcing sheet and a resin system to form a combined sheet, heating the combined sheet, compacting the combined sheet, and cooling the combined sheet to form conductive pre-impregnated composite sheet including the fiber-reinforcing sheet, and the nanomaterial composite sheet coupled to the fiber-reinforcing sheet, wherein the fiber-reinforcing sheet and the nanomaterial composite sheet are embedded in the resin system.