B32B15/092

Window and display device including the same

A window includes a base layer including a folding region in which a groove is defined and a non-folding region, and a resin disposed on the groove and including a thiol group, wherein a difference between the refractive index of the base layer and the refractive index of the resin is less than about 0.1.

Electrocoats containing at least one triazine compound

The present disclosure relates to a cathodically depositable aqueous electrodeposition coating material including at least one epoxide-amine adduct (a), at least one pigment and/or at least one filler (b), and at least one crosslinking agent (c), a fraction of at least 25 wt % of the crosslinking agent (c), based on the total weight of the crosslinking agent (c), being formed by at least one tris(alkoxycarbonylamino)-1,3,5-triazine; to a method for coating an electrically conductive substrate by cathodic electrodeposition coating using said electrodeposition coating material; to a substrate coated accordingly; and also to a use of a tris(alkoxycarbonylamino)-1,3,5-triazine in a cathodically depositable electrodeposition coating material for reducing or eliminating the sensitivity to disruption of the electrodeposition coating bath toward impurities present therein through phosphates and/or through other metal salts which have been carried into the electrodeposition coating bath as a result of pretreatment steps ahead of the electrodeposition coating.

RESIN COMPOSITION, LAYERED BODY INCLUDING RESIN COMPOSITION LAYER, LAYERED BODY, FLEXIBLE COPPER-CLAD LAMINATE, FLEXIBLE FLAT CABLE, AND ELECTROMAGNETIC WAVE SHIELDING FILM

A resin composition including a polyester polyurethane resin (A); and an epoxy resin (B), in which a molecular weight per a urethane bond of the polyester polyurethane resin (A) is from 200 to 8,000, and a layered body including a resin composition layer, a layered body, a flexible copper-clad laminate, a flexible flat cable, or an electromagnetic wave shielding film, each using the resin composition.

RESIN COMPOSITION, LAYERED BODY INCLUDING RESIN COMPOSITION LAYER, LAYERED BODY, FLEXIBLE COPPER-CLAD LAMINATE, FLEXIBLE FLAT CABLE, AND ELECTROMAGNETIC WAVE SHIELDING FILM

A resin composition including a polyester polyurethane resin (A); and an epoxy resin (B), in which a molecular weight per a urethane bond of the polyester polyurethane resin (A) is from 200 to 8,000, and a layered body including a resin composition layer, a layered body, a flexible copper-clad laminate, a flexible flat cable, or an electromagnetic wave shielding film, each using the resin composition.

FOLDABLE DISPLAY SCREEN AND MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS
20220390983 · 2022-12-08 ·

A foldable display screen and a manufacturing method thereof, and a display apparatus are provided. The foldable display screen includes a display panel and an optically clear adhesive (OCA) layer. The display panel includes a bending region and a non-bending region; and the bending region is configured to be bent along an axis extending in a first direction, the non-bending region is on at least one side of the bending region in a second direction. The OCA layer includes a first portion and a second portion, the first portion is in the bending region, an edge of the first portion in the first direction overlaps with an edge of the bending region in the first direction, the second portion is located in the non-bending region, and a spacing is formed between the second portion and an edge of the non-bending region in the first direction.

THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE
20220372208 · 2022-11-24 ·

Provided is a thermosetting resin composition including an epoxy resin and thermally conductive particles. A thermal conductivity λ.sub.200 at 200° C. of a cured product obtained by heating the thermosetting resin composition at 200° C. for 90 minutes is 12 W/(m.Math.K) or higher. In addition, a volume resistivity R.sub.200 of the cured product at 200° C. is preferably 1.0×10.sup.10 Ω.Math.m or more. In addition, a resin sheet using this thermosetting resin composition is provided. Furthermore, a metal base substrate using this thermosetting resin composition is provided.

THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE
20220372208 · 2022-11-24 ·

Provided is a thermosetting resin composition including an epoxy resin and thermally conductive particles. A thermal conductivity λ.sub.200 at 200° C. of a cured product obtained by heating the thermosetting resin composition at 200° C. for 90 minutes is 12 W/(m.Math.K) or higher. In addition, a volume resistivity R.sub.200 of the cured product at 200° C. is preferably 1.0×10.sup.10 Ω.Math.m or more. In addition, a resin sheet using this thermosetting resin composition is provided. Furthermore, a metal base substrate using this thermosetting resin composition is provided.

CONNECTING TAPE MICROSTRUCTURE AND MANUFACTURING METHOD THEREOF
20220371303 · 2022-11-24 ·

A connecting tape microstructure includes a reinforced layer and two plastic layers. The reinforced layer has a first Young's modulus. The plastic layers are disposed on two opposite sides of the reinforced layer. Each of the plastic layers has a second Young's modulus. The first Young's modulus is larger than the second Young's modulus.

CONNECTING TAPE MICROSTRUCTURE AND MANUFACTURING METHOD THEREOF
20220371303 · 2022-11-24 ·

A connecting tape microstructure includes a reinforced layer and two plastic layers. The reinforced layer has a first Young's modulus. The plastic layers are disposed on two opposite sides of the reinforced layer. Each of the plastic layers has a second Young's modulus. The first Young's modulus is larger than the second Young's modulus.

Battery packaging material, battery, and method for producing battery packaging material

A battery packaging material that is excellent in electrolytic solution resistance and ink printing characteristics of the surface. A battery packaging material comprising a laminate having at least a protective layer, a base material layer, a barrier layer, and a heat-sealable resin layer in this order, wherein a maximum value A of absorbance detected in an infrared wavenumber range of 2800 to 3000 cm.sup.−1 and a maximum value B of absorbance detected in an infrared wavenumber range of 2200 to 2300 cm.sup.−1 satisfy the relation: 0.05≤B/A≤0.75, as measured from an outermost surface of the protective layer, using attenuated total reflection Fourier transform infrared spectroscopy.