A method for producing a laminated film for temporary fixation of a semiconductor member to a support member includes providing a first curable resin layer on one surface of a metal foil and providing a second curable resin layer on the other surface of the metal foil to obtain the laminated film. A laminated film used for temporarily fixing a semiconductor member to a support member includes a first curable resin layer, a metal foil, and a second curable resin layer laminated in sequence.

The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).

The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).

A vehicle sandwich component with a layered construction having a honeycomb structure. The honeycomb structure may have a first lower honeycomb layer and a second upper honeycomb layer, the first lower honeycomb layer has at least one edge portion protruding laterally in the transverse direction beyond the second upper honeycomb layer, and a central honeycomb layer region or compression region which has a reduced thickness, achieved by compression, in relation to the edge portion and on which the second upper honeycomb layer is provided. Also, method for producing a vehicle-sandwich component of this type.

A vehicle sandwich component with a layered construction having a honeycomb structure. The honeycomb structure may have a first lower honeycomb layer and a second upper honeycomb layer, the first lower honeycomb layer has at least one edge portion protruding laterally in the transverse direction beyond the second upper honeycomb layer, and a central honeycomb layer region or compression region which has a reduced thickness, achieved by compression, in relation to the edge portion and on which the second upper honeycomb layer is provided. Also, method for producing a vehicle-sandwich component of this type.

The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.

The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.

A multilayer laminated substrate is characterized in that at least a transparent resin substrate [A], a metal oxide layer [C], an electroconductive metal layer [D], a high refractive index metal oxide layer [E], and a protection layer [F] containing at least one of an inorganic oxide and an inorganic nitride are stacked in this order and the following (1) and (2) are satisfied: (1) a film thickness of the protection layer [F] is 5 nm to 300 nm; and (2) relative to a sum total of one or more metal elements, one or more semimetal elements, and one or more semiconductor elements contained in the protection layer [F], a content percentage by mass of carbon contained in the protection layer [F] is less than or equal to 50%.

Floor element for forming a floor covering, wherein the floor element comprises a decorative layer, a support layer, and an intermediate layer disposed between the decorative layer and the support layer, wherein the decorative layer is made of a brittle material, wherein the floor elements comprises edges provided with coupling elements adapted to cooperate with coupling elements of an adjacent similar floor element in said floor covering and wherein the intermediate layer comprises at least one edge that is offset relative to a respective edge of the decorative layer.

An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm.sup.2.