B32B15/098

MOLDED POLYMER AND METAL ARTICLES
20170232710 · 2017-08-17 · ·

There is provided a metal-organic composite which exhibits synergistic improvement in thermo-mechanical properties when compared with either of the components alone. The composites of this invention can be readily fabricated into various shapes by conventional molding processes including injection or compression molding. As a result, the composites of this invention find a variety of applications in fabricating a variety of three dimensional articles including automotive parts among others.

LIQUID CRYSTAL POLYMER FILM AND LAMINATE COMPRISING THE SAME
20220032575 · 2022-02-03 ·

Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a ratio of a ten-point mean roughness relative to a maximum height (Rz/Ry) of the first surface is from 0.30 to 0.62. By controlling Rz/Ry of at least one surface of the LCP film, the peel strength of the LCP film stacked to a metal foil can be increased, and the laminate comprising the same can still maintain the merit of low insertion loss.

PACKAGING MATERIAL FOR BATTERIES

Provided is a packaging material for batteries, which has excellent insulating properties. A packaging material for batteries, which is formed of a laminate that is obtained by sequentially laminating at least a base layer, a bonding layer, a metal layer and a sealant layer, and wherein the base layer comprises a resin layer A that is formed of a thermoplastic resin having a volume resistivity of 1×10.sup.15 Ω.Math.cm or more.

PACKAGING MATERIAL FOR CELL

A film-shaped packaging material for a cell in which a coating layer is provided as the outermost layer instead of a substrate layer and an adhesive layer in a conventional film-shaped packaging material for a cell, thereby making it possible to produce a thinner film; wherein the packaging material is provided with exceptional moldability and insulation performance and enables lead time to be reduced. The packaging material is a laminate having at least a coating layer, a barrier layer, and a sealant layer in the stated order, the coating layer including a single- or multiple-layer configuration formed by a cured product of a resin composition containing a heat-curable resin and curing accelerator, the laminate having a piercing strength of at least 5 N, as measured in compliance with JIS 1707:1997, and the coating layer having a breakdown voltage of at least 1.0 kV, as measured in compliance with JIS C2110-1.

CYANIC ACID ESTER COMPOUND AND METHOD FOR PRODUCING SAME, RESIN COMPOSITION, AND CURED PRODUCT

The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1):

##STR00001##

wherein n represents an integer of 1 or larger.

CYANIC ACID ESTER COMPOUND AND METHOD FOR PRODUCING SAME, RESIN COMPOSITION, AND CURED PRODUCT

The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1):

##STR00001##

wherein n represents an integer of 1 or larger.

PREPREG, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD
20170218150 · 2017-08-03 ·

A prepreg includes a fiber base material and a thermosetting resin composition impregnated into the fiber base material. The thermosetting resin composition contains a thermosetting resin including an epoxy resin; a curing agent; an inorganic filler; and an acrylic acid ester copolymer having a weight average molecular weight of 10×10.sup.4 or more and less than 45×10.sup.4. A content of the inorganic filler is 150 parts by mass or more relative to a total of 100 parts by mass of the thermosetting resin and the curing agent. A content of the acrylic acid ester copolymer is more than 30 parts by mass and 90 parts by mass or less relative to the total of 100 parts by mass of the thermosetting resin and the curing agent.

Halogen-free resin composition and use thereof
09771479 · 2017-09-26 · ·

The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.

Halogen-free resin composition and use thereof
09771479 · 2017-09-26 · ·

The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.

Display unit

A display unit according to an embodiment of the disclosure includes a substrate, a wiring line and a light-emission section that are provided on the substrate, an insulating layer covering the wiring line and the light-emission section, and provided on an entire surface of the substrate, and a sealing layer provided on an entire surface of the insulating layer, and including a resin material having an oxygen transmission rate higher than a water-vapor transmission rate.