Patent classifications
B32B2038/168
Roll-to-roll slot die coating method to create interleaving multi-layered films with chemical slurry coatings
An improved method for manufacturing a continuous self-healing barrier film is provided. The method includes slot-die coating opposing sides of a separator substrate with a curing agent slurry and a curable resin slurry using a single-sided coating line or a tandem coating line. The method also includes sequentially interleaving inner and outer protective layers via a continuous roll-to-roll process to create a multi-layered barrier film. The barrier film can optionally be formed into a barrier envelope, and an insulating core material can be inserted into the barrier envelope to define an enclosure. Evacuating and sealing the enclosure along a perimeter of the barrier envelop forms a self-healing vacuum insulation panel with excellent properties for use as a building material and in refrigeration systems, for example. The barrier film can alternatively be used in the manufacture of tires, roofing, cargo containers, food packaging, and pharmaceutical packaging, for example.
COMPOSITE MATERIAL FOR PRODUCING AN ACOUSTIC MEMBRANE
A composite material for producing an acoustic membrane, wherein the composite material comprises a silicone layer comprising an at least partially uncured silicone rubber and a support layer, wherein the support layer is adjacent to the silicone layer, as well as a method of preparing such a composite material and a process for producing an acoustic membrane from such a composite material.
REACTIVATION OF CO-CURED FILM LAYERS
The present disclosure is directed to a method for reactivating a co-cured film layer disposed on a composite structure, the method comprising applying a reactivation treatment composition comprising at least two solvents and a surface exchange agent comprising a metal alkoxide or chelate thereof to the co-cured film layer, and allowing the reactivation treatment composition to create a reactivated co-cured film layer, wherein the co-cured film layer was previously cured at a curing temperature greater than about 50° C. A reactivated co-cured film layer and an aircraft part having a reactivated co-cured film layer are also provided.
METHOD FOR PRODUCING RELIEF-PATTERN FORMATION, APPARATUS FOR PRODUCING THE SAME, AND SEAL
A method and an apparatus for producing a relief-pattern forming, the method and apparatus being suitable for producing a film-like material, such as an embossed film, having a fine relief-structure pattern formed on a surface thereof so as to have a distinctive optical effect with higher quality, good productivity, and fewer defects. A transfer pattern printed layer having an inverted structure of a relief-structure pattern is formed on a second substrate by printing a transfer pattern onto the surface of a first substrate on which the relief-structure pattern is formed at a predetermined position by registration with the relief-structure pattern followed by drying, laminating with the second substrate, curing and peeling.
IMPACT RESISTANT UNDERBODY SHIELD MATERIALS AND ARTICLES AND METHODS OF USING THEM
Underbody shield materials that can provide an underbody shield with high impact resistance are described. In some configurations, an underbody shield composition comprises a porous core layer comprising a plurality of reinforcing fibers, a lofting agent and a thermoplastic material. In some instances, the underbody shield composition may also comprise a film such that an underbody shield produced from the composition can withstand at least 50 individual impacts as tested using a SAE J400 protocol.
Protective film
A protective film has a soluble polyimide polymer base layer and an exterior layer directly containing the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the as layer can also include additives, as desired.
ADHESIVE LAYER FORMING DEVICE, SEMICONDUCTOR CHIP PRODUCTION LINE, AND METHOD FOR PRODUCING LAMINATE
Provide are: a method for producing a laminate having an adhesive layer on one surface of a semiconductor wafer, with the adhesive layer being less likely to foam during wafer bonding under reduced pressure, curing of an adhesive being less likely to occur, and also allowing a tact time to be shortened; and an adhesive layer forming device to be used in the method. The adhesive layer forming device for forming an adhesive layer by removing a solvent in a coating film coated and formed on one surface of a semiconductor wafer includes: a lower plate on which the semiconductor wafer is placed; an upper cover configured to form a closed space together with the lower plate, the closed space having a volume of 10 liters or less; and pressure reducing means for reducing pressure in the closed space.
ROLL-TO-ROLL SLOT DIE COATING METHOD TO CREATE INTERLEAVING MULTI-LAYERED FILMS WITH CHEMICAL SLURRY COATINGS
An improved method for manufacturing a continuous self-healing barrier film is provided. The method includes slot-die coating opposing sides of a separator substrate with a curing agent slurry and a curable resin slurry using a single-sided coating line or a tandem coating line. The method also includes sequentially interleaving inner and outer protective layers via a continuous roll-to-roll process to create a multi-layered barrier film. The barrier film can optionally be formed into a barrier envelope, and an insulating core material can be inserted into the barrier envelope to define an enclosure. Evacuating and sealing the enclosure along a perimeter of the barrier envelop forms a self-healing vacuum insulation panel with excellent properties for use as a building material and in refrigeration systems, for example. The barrier film can alternatively be used in the manufacture of tires, roofing, cargo containers, food packaging, and pharmaceutical packaging, for example.
BAMBOO STRIP SUBSTRATE BOARD AND PREPARATION METHOD THEREOF, BAMBOO STRIP FLOOR AND APPLICATION THEREOF
The present invention provides a bamboo strip substrate board and a preparation method thereof, a bamboo strip floor and application thereof. The method for preparing a bamboo strip substrate board provided by the present invention includes the following steps: placing a bamboo strip curtain in a glue-containing solution for glue dipping and draining glue to obtain a glue-containing bamboo strip curtain; drying the glue-containing bamboo strip curtain and then performing assembly to obtain a bamboo strip board blank; and subjecting the bamboo strip board blank to hot pressing to obtain a bamboo strip substrate board. According to the present invention, an outdoor bamboo-based floor is further prepared on the basis of a bamboo strip substrate board. The present invention a simplified preparation process, so the production cost is effectively reduced, and the weather resistance of the floor is improved.
BIFUNCTIONAL FILM AND METHOD FOR PREPARING THE SAME
A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer; and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution 1:0.01-1. Moreover, the second polymer solution consists of a second hydrophilic solution.