Patent classifications
B32B38/1833
SYSTEM AND METHOD FOR APPLYING AN IMAGE TO A SUBSTRATE TO FORM A DISPLAY ARTICLE
A product for displaying an image or object (e.g., printed photo or a print, etc.) according to at least one implementation includes a first sheet having a front face and a rear face. An image or object is formed along the rear face. The product also includes an adhesive coated substrate, such as a ferrous metal substrate, to which the first sheet is adhesively affixed.
Film-embossing apparatus
A film-embossing apparatus with a hot-embossing device which has a heated embossing stamp. With the formation of a contact pressure, a transfer layer, arranged on a carrier film, of a hot-embossing film is transferred to a surface of a workpiece. The hot-embossing device has control inputs and outputs. The film-embossing apparatus has an industrial robot with control inputs and outputs. The control inputs and outputs of the hot-embossing device and of the industrial robot are connected to a control unit. The industrial robot is formed such that it guides the workpiece to the hot-embossing device, positions the workpiece on the embossing stamp, guides the workpiece past the embossing stamp, and guides the embossed workpiece away from the hot-embossing device. The industrial robot can also position the hot-embossing device on the workpiece.
Film releasing assembly, film sticking machine and method for using the film sticking machine
Disclosed are a film releasing assembly, a film sticking machine and a method for using the film sticking machine. The film releasing assembly comprises a pedestal and a sliding block seat. The pedestal is recessed inwards to form a process groove therein, and the process groove defines a positioning area and a film sticking area which are communicated with each other. The sliding block seat is arranged in the process groove and capable of reciprocating in the positioning area and the film sticking area, and the sliding block seat at one end thereof facing to the film sticking area comprises a pushing portion formed to peel a release layer off from a film and guide the release layer peeled downwards to the process groove.
Sheet processing device, laminating device, image forming apparatus, and image forming system
A sheet processing device includes a conveyor, a rotator, a separator, and control circuitry. The conveyor conveys a sheet-shaped medium into a two-ply sheet in which two sheets are overlaid and partially bonded, and includes a drive roller and a driven roller. The rotator winds the two-ply sheet. The separator separates the two sheets of the two-ply sheet. The control circuitry causes the conveyor to convey the two-ply sheet in a winding direction to wind the two-ply sheet around the rotator to generate a space between the two sheets, and causes the separator to insert into the space between the two sheets to separate the two sheets. The drive roller and the rotator are disposed on a same side with respect to a sheet conveyance passage of the two-ply sheet, and the driven roller and the rotator are disposed on opposite sides with respect to the sheet conveyance passage.
Insulated metal substrate and method for manufacturing same
An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm.sup.2.
Apparatus for reticulation of adhesive and methods of use thereof
A method, apparatus, and system for reticulating an adhesive on a workpiece. The workpiece may be perforated with a plurality of passages that extend through a first side to a second side. To reticulate an adhesive on the first side of a workpiece, a flow of heated fluid is provided through a nozzle. The nozzle provides the fluid at a first pressure to a first group of the perforations. Once the temperature at the first side of the workpiece reaches a specified range, the fluid pressure may be increased or otherwise set in order to clear the perforations by forcing the adhesive out of or away from each of the perforations. Temperature of the adhesive, pressure within the nozzle, and/or light passage through the perforations may be monitored for logical control or quality assurance.
CHUCK FOR SUPPORTING A WAFER
According to an embodiment, a support module is provided for supporting a substrate. The support module may include a chuck and a vertical stage. The chuck may include multiple chuck segments that are independently movable. When the substrate is positioned on the chuck, different chuck segments are positioned under different areas of the substrate. The vertical stage may include multiple piezoelectric motors. Each piezoelectric motor may be configured to perform nanometric scale elevation and lowering movements. The multiple piezoelectric motors may be configured to independently move the multiple chuck segments.
APPARATUS AND METHOD FOR MANUFACTURING CELL
Discussed is an apparatus for manufacturing a cell, the apparatus including: a center electrode reel from which a center electrode is to be unwound; a first heater configured to apply radiant heat to the unwound center electrode; an upper separator reel from which an upper separator to be laminated on a top surface of the center electrode is to be unwound; a lower separator reel from which a lower separator to be laminated on a bottom surface of the center electrode is to be unwound; an upper electrode reel from which an upper electrode to be laminated on a top surface of the upper separator is to be unwound; and a second heater configured to apply radiant heat to the unwound upper electrode.
METHOD FOR CONCEALING OPTICAL DEFECTS IN SURFACES
A method conceals optical defects in surfaces. The method includes: obtaining a digital image by a digital optical recording the optical defect and a surrounding surface; obtaining an imitation of the surface in a region of the at least one optical defect by image processing of the digital image; printing a mirror-inverted, true-to-scale representation of the surface imitation onto a transfer film; soaking the transfer film; applying an activator onto a the transfer film or onto the surface; aligning the transfer film onto the surface so that the surface imitation on the transfer film coincides with the optical defect on the surface; pressing the transfer film onto the surface; peeling the transfer film from the surface; pressing on the ink remaining on the surface; and after complete drying of the activator and of the ink: applying a protective layer onto the surface imitation.
INSULATED METAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm.sup.2.