A display module includes a display panel having a plurality of pixels and a display driver configured to drive a partial portion of the plurality of pixels that are positioned in an alignment mark area to display an alignment mark in the alignment mark area. A stereoscopic lens including a base is disposed on the display module. A plurality of lenses is disposed on the base and includes at least one flat portion surrounded by the plurality of lenses and overlapping the alignment mark area.

A method for applying raised features to a semiconductor substrate chuck, each feature acting to space a substrate from the chuck in use, the method comprising the steps of: i) providing an assembly having a carrier layer, a feature adhered to the carrier layer, and a peel-ply layer adhered to the carrier layer such that the feature is enclosed between the carrier layer and the peel-ply layer, ii) removing the peel-ply layer, and iii) adhering the feature to the chuck.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

There is provided a pressure maintaining and alignment device, comprising a box body that is open at its front side to form an outer opening having a certain depth; a cover assembly for opening and closing outer opening; a pushing assembly disposed on a rear side of box body for selectively clamping a product to be pressure-maintained; and a pressing assembly located at a rear side of the pushing assembly; wherein pressing assembly comprises a pushing rod and a pressing plate, at least one pressing arm extending to above the box body is provided at top of pressing plate, an alignment adjusting assembly is provided between pressing arm and box body, and pressing plate selectively pushes alignment adjusting assembly by the pressing arm under driving of pushing rod, so that the product to be pressure-maintained in the box body is selectively pressed, pressure-maintained and aligned.

An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.

In order to optimize a method for stiffening a metal component by pressing a fiber-reinforced plastic insert onto the metal component in such a way that the method can be integrated into the serial production of the car body, it is proposed that the fiber-reinforced plastic insert be picked up by means of a robot-controlled application head and pressed onto the metal component.

The invention is directed to a pressing equipment for manufacturing a floor element, wherein the pressing equipment comprises a press configured to press an upper decorative layer of the floor element upon a lower support layer of the floor element, a positioning device configured to place the floor element in a pressing position at the press, and a centering device configured to adjust the mutual position of the upper decorative layer of the floor element and of the lower support layer of the floor element.