The electret-treated sheet includes: a core layer (A) which is a porous film containing at least a thermoplastic resin; a surface layer (X) disposed on one side of the core layer (A); and a back surface layer (Y) disposed on the other side of the core layer (A), the surface layer (X) and the back surface layer (Y) each having a charged outermost surface, wherein the electret-treated sheet has a water vapor permeability coefficient of 0.1 to 2.5 g.Math.mm/m.sup.2.Math.24 hr; the core layer (A) has a pore aspect ratio of 5 to 50 and an average pore height of 2.5 to 15 μm; the surface layer (X) and the back surface layer (Y) each have a thickness of 5 to 200 μm; and the surface layer (X) includes a heat seal layer (B) including the outermost surface, wherein the heat seal layer (B) has a melting point of 50 to 140° C.

The invention provides a biaxially oriented polypropylene-based resin film having a base layer (A) consisting of a polypropylene-based resin composition and surface layers (B) consisting of a polypropylene-based resin composition on both sides of base layer (A), wherein the film has a) a mesopentad fraction of the polypropylene-based resin composition constituting base layer (A) of 95.0 to 99.5%; b) a ratio of α-olefin monomer-derived component to a total of propylene monomer-derived component and α-olefin monomer-derived component in the polypropylene-based resin composition constituting base layer (A) of 0.2% by mole or less; c) a ratio of butene-1 monomer-derived component to a total of propylene monomer-derived component and α-olefin monomer-derived component in the polypropylene-based resin composition constituting surface layers (B) of 5 to 10% by mole; and d) a thickness of 60 μm or less, wherein the thickness of surface layers (B) is 3-10% of the total layer thickness of the film.

Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.

Provided is a mold release film capable of transferring a concave-convex structure to the surface of an adhesive film.

Described herein is a multilayered article (10) and methods of making and using such articles. The multilayered article (10) comprises: ⋅ (a) a microsphere layer (11) comprising a plurality of microspheres disposed in a monolayer; ⋅ (b) a bead bonding layer (12) comprising a first major surface and a second opposing major surface and the plurality of microspheres is partially embedded in the first major surface of the bead bonding layer, and comprises a thermoset polyurethane having a glass transition temperature of at least 35° C.; ⋅ (c) a primer layer (14) disposed on the second major surface of the bead bonding layer wherein the primer layer comprises a copolymer of polyurea and polyurethane and wherein the primer layer is covalently attached to the bead bonding layer via urea linkages; and ⋅ (d) an elastomeric layer (16) disposed on the primer layer opposite the bead bonding layer, wherein the elastomeric layer comprises a polyurethane thermoplastic elastomer.

The present disclosure is directed to provide a multilayer film for use in an air bag, which provides sufficient adhesiveness and blocking tendency in a well-balanced manner. The multilayer film for use in an air bag according to the present disclosure includes an adhesive layer and an outer layer. The adhesive layer includes a resin having a glass transition temperature from 0° C. to 80° C. and a melting point from 100° C. to 160° C. The outer layer includes a resin having a melting point higher than the melting point of the resin included in the adhesive layer by 20° C. or higher. Further, an air bag according to the present disclosure includes a synthetic fiber fabric and the aforementioned multilayer film for use in an air bag, in which the adhesive layer in multilayer film is laminated with the synthetic fiber fabric.

The embodiments relate to a polyamide-imide film excellent in optical properties and mechanical properties, to a process for preparing the same, and to a cover window and a display device comprising the same. There are provided a polyamide-imide film, which comprises a polyamide-imide polymer and has a reduced modulus of a top surface measured by the nanoindentation method according to the ISO 14577-2 standard of 5.6 GPa or more and a haze of 1% or less, a process for preparing the same, and a cover window and a display device comprising the same.

The invention provides a white polyester film formed with a polyester resin whose main constituent is ethylene terephthalate, and (1) the film has at least two or more layers, and has at least one white layer and at least one heat sealing layer, wherein at least one of the film surfaces is the heat sealing layer, and the film satisfies the prescribed requirements of (2) the peeling strength of the heat sealing layers, (3) the difference in reversing heat capacity between at a lower and a higher temperature than a glass transition temperature of the heat sealing layer, (4) the heat shrinkage in both a longitudinal and width direction when treated in hot water at 80° C. for 10 seconds, (5) the total light transmittance, and (6) the apparent specific gravity.

A flooring underlayment including a multi-layer fibrous structure having one or more lapped layers; one or more facing layers; and a plurality of granules scattered on and/or embedded in one or more layers of the fibrous structure. The plurality of granules may be scattered on and/or embedded in at least one of the one or more lapped layers. The fibrous structure may include a granule support layer located beneath the plurality of granules. The granule support layer may be positioned on the lapped layer. The granules may be deposited on the granule support layer. The present teachings also include a flooring assembly including the fibrous structure and one or more flooring surfaces.

A prepreg comprising the following constituent elements (A), (B), and (C), the constituent element (C) being present in a surface layer of the prepreg: Constituent element (A): a reinforcing fiber base material; Constituent element (B): an epoxy resin composition containing a curing agent, the epoxy resin composition being cured within the range of from 90° C. to 140° C. (inclusive); and Constituent element (C): particles of a thermoplastic resin having a melting point or a glass transition temperature within the range of from 90° C. to 140° C. (inclusive).