B32B2264/025

ANTIMICROBIAL MULTILAYER FILM
20220363848 · 2022-11-17 ·

A multilayer film containing up to 15 wt % of a blend of cis-13-docosenamide and at least one primary antimicrobial material on or in an exterior layer of the film. The blend of cis-13-docosenamide and at least one primary antimicrobial material is either extruded as part of the surface layer of the film or coated onto the surface of the film.

Construction Panel Having Improved Fixing Strength

A plasterboard comprising a gypsum matrix having wood particles embedded therein in an amount of at least 2 wt % relative to the gypsum, the gypsum matrix further comprising glass fibres in an amount of at least 1 wt % relative to the gypsum.

ELEVATED PET WASTE COLLECTION TRAINING PAD
20220354086 · 2022-11-10 ·

Pet waste collection training pads having one or more regions elevated from a surface upon which the pads are to be disposed. More specifically, the present disclosure discloses a pet waste collection training pad arrangeable on a selected surface, comprising at least one upper layer and at least one lower layer; the at least one upper layer containing absorbent; and the at least one lower layer including at least one pleat having a base, wherein the at least one pleat elevates a region of the pad relative to the base of the pleat when the pad is on the selected surface.

Block copolymer hydrogenate, resin composition, and various applications thereof

A block copolymer including a polymer block (A) containing more than 70 mol % of a unit derived from an aromatic vinyl compound, and a polymer block (B) containing 30 mol % or more of a unit derived from a conjugated diene compound is provided. The block copolymer satisfies the conditions: (1): a content of the polymer block (A) in the block copolymer is 1 to 70% by mass; (2): a maximum width of a series of temperature regions where tan δ measured in accordance with JIS K7244-10 (2005), under conditions including a strain amount of 0.1%, a frequency of 1 a measurement temperature of −70 to 100° C., and a temperature rise rate of 3° C./min, is 1.0 or more is less than 16° C.; (3): a temperature at a peak position of tan δ in the condition (2) is 0° C. to +50° C.; and (4): a mobility parameter M indicating a mobility of the polymer block (B) is 0.01 to 0.25 sec.

Functional tie-layer formulations in biaxially oriented films containing HDPE

Disclosed are compositions and methods for multilayer films, which, in one embodiment may comprise a core layer comprising at least 50 wt. % of high-density polyethylene. Further, the multilayer film may include a first skin layer consisting essentially of one or more ethylene-propylene copolymers. Further still, the multilayer film may include a second skin layer consisting essentially of one or more ethylene-propylene-butylene terpolymers. And yet further, the multilayer film may be oriented in at least one direction, and at least two layers of the multilayer film are coextruded.

POLYMER FILM AND LAMINATE
20230070617 · 2023-03-09 · ·

An object of the present invention is to provide a polymer film having a low dielectric loss tangent and a small difference in a linear expansion coefficient from that of a copper foil; and a laminate.

The polymer film of an embodiment of the present invention is a polymer film including a liquid crystal polymer, in which a hardness A at a distance of half of a thickness of the polymer film and a hardness B at a distance of 1/10 of the thickness of the polymer film satisfy a relationship of Expression (1A), and in a case where positions at distances of 1/10, 4/10, and 6/10 of the thickness of the polymer film are defined as a position T1, a position T2, and a position T3, respectively; and a region from the one surface to the position T1 is defined as a first surface layer region, and a region from the position T2 to the position T3 is defined as a central region, a void area proportion X in the first surface layer region and a void area proportion Y in the central region satisfy a relationship of Expression (2A).

[00001]Hardness A + Hardness B/20.10GPa

[00002]Void area proportion Y - Void area proportion X0.10%

Method for manufacturing quantum dot film comprising encapsulated quantum dots uniformly dispersed therein, quantum dot film manufactured thereby and wavelength conversion sheet and display comprising same

The present invention relates to a method of manufacturing a quantum-dot film having encapsulated quantum dots dispersed therein, in which quantum dots are uniformly dispersed in a matrix resin to thus increase quantum yield and in which deterioration of the quantum dots can be prevented through encapsulation, a quantum-dot film manufactured thereby, and a wavelength conversion sheet and a display including the same.

CHARGING MEMBER HAVING A SURFACE LAYER COMPRISING URETHANE FOAM
20230113423 · 2023-04-13 ·

A charging member for an image forming apparatus may include a conductive support and a surface layer on the conductive support and not in contact with a photosensitive member. The surface layer may comprise a urethane foam including foam cells and having a foam structure based on the foam cells, the foam cells including open cells.

Vinyl chloride-based resin composition for powder molding, and vinyl chloride-based resin-molded body and laminate

A composition of polyvinyl chloride for powder molding may include a polyvinyl chloride (A), a polyvinyl chloride (B), and a phosphate, among others. The polyvinyl chloride (A) may have an average particle diameter of 50 to 500 μm, and the polyvinyl chloride (B) may have an average particle diameter of 0.01 μm or more and less than 50 μm. An average polymerization degree of the polyvinyl chloride (A) may be 1350 or more, and the phosphate may comprise a polyoxyalkylene alkyl phosphate.

CHARGING MEMBER WITH COATING LAYER

A charging member, including: a conductive support; and a conductive body mounted on the conductive support, in which the conductive body includes an elastic layer located on the conductive support, a resin layer located on the elastic layer, and a coating layer located on the resin layer to form an outermost surface of the conductive body, and the coating layer contains a polysiloxane compound having a molecular structure that includes an Si—O—Zr bond.