An air-permeable adhesive sheet has air permeability in a thickness direction thereof and including an adhesive agent layer having first through holes extending in the thickness direction, wherein at least one surface of the adhesive agent layer forms an adhesive surface, the through holes have an average opening diameter of 1.0 to 50 μm and an average interval of 5 to 400 μm, and a variation in air permeability in the thickness direction is 22% or less as represented by a coefficient of variation of an air permeability measured according to Method B for air permeability measurement (Gurley method) specified in JIS L 1096: 2010, with an effective measurement area as a predetermined value selected from 0.5 to 2.0 mm.sup.2. The air-permeable adhesive sheet is a sheet capable of obtaining good characteristics such as air permeability even when being made into a sheet having a small area.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

A composite laminate surface covering member in the form of a sheet, panel or mat having an upper layer of bonded, vibration oriented, polymer granules, the upper layer being water permeable and possessing an extensive irregular channeling system formed by the voids between the granules, and a sub-layer of a closed cell polymer that is water impermeable. Additional layers for reinforcing purposes may also be present.

A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), ##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.

Described in this disclosure is a surface configured to break down deposits thereon. The surface may include breakdown structures, oleophilic structures, and hydrophilic structures. The oleophilic structures and hydrophilic structures are configured to disperse a deposit, such as fingerprint residue, to the breakdown structures. This dispersion increases the surface area of the deposit with respect to the breakdown structures, increasing the contact area between the two. The breakdown structures modify the deposit physically, chemically, or both, such that fragments are distributed into the ambient environment. The surface may be applied to portable electronic devices.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

An embodiment dash isolation pad includes a 3D vertical nonwoven fabric layer having a structure in which wave-type short fibers are vertically arranged, a sound absorption layer on one side or both sides of the 3D vertical nonwoven fabric layer, and an olefin-based powder layer between the 3D vertical nonwoven fabric layer and the sound absorption layer.

A composite foam article is disclosed herein. The composite foam article comprises a polyurethane foam core presenting a first surface and a second surface facing opposite the first surface. A first skin is disposed on the first surface and a second skin is disposed on the second surface. The polyurethane foam core has a density of 15-80 kg/m.sup.3. The first and second skins comprise a plurality of fibers and a polymeric binder. The composite foam article has a weight per unit area of 500-1000 g/m.sup.2 and a strength of greater than 17 N at a post-compression thickness of greater than 2 mm when tested in according with SAE J949 at 23° C.

Fabrication processes are provided for a fabric product that provide a continuous moisture and/or thermal barrier around the fabric product, eliminating moisture and thermal leakage through seams and other stitching perforations, and creating an equal barrier quality throughout the structure of the fabric product. A fabric product is also provided.

Described herein is a composition comprising (i) a hydrofluorothermoplastic polymer, wherein the hydrofluorothermoplastic polymer is derived from: (a) 50-85 mol % tetrafluoroethene; (b) 2-15 mol % hexafluoropropene; (c) 10-35 mol % vinylidene fluoride; and (d) 0.1 to 5 mol % of a bromine-containing monomer; and (ii) a perhalogenated thermoplastic polymer. Such compositions can be used in multilayer constructions in, for example, fuel hose applications.