Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si—H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).

To provide a biaxially oriented polyester film that has extremely low content of antimony, excellent hygiene, few foreign substances, excellent transparency and heat resistance, and is excellent in printability, workability, and productivity. A biaxially oriented polyester film characterized by a content of antimony in the film of 10 ppm or less, a content of phosphorus in the film of 25 ppm or more and 75 ppm or less, an intrinsic viscosity of the film of 0.51 dl/g or more and 0.70 dl/g or less, and a number of defects with a size of 1 mm or more is 1.0 or less per 1000 square meters of the film.

A plastic wrap and a method for manufacturing the same are provided. The plastic wrap includes at least one resin layer that includes a resin composition. The resin composition includes, based on 100 wt % of the resin composition, 1 to 14 wt % of an inorganic nano powder. The inorganic nano powder includes 1 to 30 wt % of zinc oxide, 1 to 20 wt % of titanium oxide, and at least one of 1 to 35 wt % of a silver salt-doped silicon oxide and 1 to 15 wt % of a rare earth metal salt.

A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), ##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.

The present disclosure provides a polymeric membrane. The polymeric membrane includes a first thermoplastic elastomer layer. The thermoplastic elastomer layer includes a filler component that is at least about 30 wt % of the thermoplastic elastomer layer. The polymeric membrane can further include an optional second thermoplastic elastomer layer in contact with the first polyolefin layer.

The present disclosure discloses a multilayer film comprising: (a) at least one print layer (102); (b) at least one tie layer (104); (c) at least one second tie layer (108); and (d) at least one sealant layer (110), wherein the multilayer film comprises at least one polyethylene having a weight percentage in the range of 80-95% with respect to the multilayer film, and a density in the range of 0.941-0.99 gm/cm.sup.3. Also disclosed herein is a process of manufacturing a multilayer film.

The present disclosure relates to a dielectric substrate that may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D.sub.10 of at least about 1.0 microns and not greater than about 1.7, a D.sub.50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D.sub.90 of at least about 2.7 microns and not greater than about 6 microns.

A suspended-particle device with improved adhesion between the active and conductive layers is disclosed. The conductive layers are coated with an adhesion promoter that comprises at least one organosilane that covalently bonds to the surface of the conductive layer and comprises a cross-linkable moiety such as an acrylate. The active layer comprises a suspension of active particles in a polymer matrix that comprises a polymer having pendant cross-linkable moieties such as acrylates. Upon curing (e.g. by irradiation by ultraviolet light), the polymer matrix of the active layer cross-links with the cross-linkable moieties of the adhesion promoter, thereby binding the active and conductive layers.

The present invention relates to a multilayer film including at least one film surface which has an increased surface roughness achieved by protrusion creating particles. The at least one film surface may have a surface roughness characterized by a coefficient of roughness (CR) of ≥0.02 or a Parker Print Surf roughness of at least 2 μm.

Implementations for composite display cover are described and provide improved protection and durability to device displays as compared with conventional display protection technologies. The described composite display cover, for instance, utilizes an ultra-thin glass layer with a polymer film applied directly to the glass layer and a hard coat applied to the polymer film. The polymer film, for instance, is applied to the glass layer without an adhesive. Further, the composite display cover can be attached to a display, such as via an adhesive layer that adheres the glass layer to a surface of the display.