Patent classifications
B32B2264/1024
Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same
A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), ##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.
Polymeric Membrane Useful As A Commercial Roofing Membrane
The present disclosure provides a polymeric membrane. The polymeric membrane includes a first thermoplastic elastomer layer. The thermoplastic elastomer layer includes a filler component that is at least about 30 wt % of the thermoplastic elastomer layer. The polymeric membrane can further include an optional second thermoplastic elastomer layer in contact with the first polyolefin layer.
PROBE PIN CLEANING PAD AND CLEANING METHOD FOR PROBE PIN
A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.
Cured product, and optical element, diffractive optical element, optical apparatus, and imaging device using the cured product
A cured product contains a dispersant, inorganic particles, and a resin that is a product of polymerization or copolymerization of a curable resin. The dispersant contains a compound represented by a formula R—X, wherein R represents a group having an acryloyloxy group or a methacryloyloxy group at an end of the molecule thereof, and X represents a carboxy group. The dispersant content is 10 parts by volume to 20 parts by volume relative to 100 parts by volume of the cured product. The curable resin contains at least one monomer having an N number of polymerizable reactive group, wherein N represents an integer of 2 or more. The proportion of the at least one monomer is 25 parts by volume to 76 parts by volume relative to 100 parts by volume of the cured product.
PHOTOVOLTAIC MODULES
Photovoltaic modules include a front sheet, a back sheet, a photovoltaic layer, a first encapsulant layer, and a second encapsulant layer. The front sheet is made of or includes a composite of a thermoplastic material and a nanoparticle filler dispersed in the thermoplastic material. The thermoplastic material is a poly(methyl methacrylate) or a polycarbonate. The nanoparticle filler may include nanoparticles such as silica nanoparticles, titania nanoparticles, zirconia nanoparticles, zinc oxide nanoparticles, and combinations thereof, for example. The photovoltaic layer is interposed between the front sheet and the back sheet and includes at least one photovoltaic cell. The first encapsulant layer is interposed between the front sheet and the at least one photovoltaic cell. The second encapsulant layer is interposed between the at least one photovoltaic cell and the back sheet.
PLASTIC INTERMEDIATE FILM, LAMINATE INCLUDING SAME, AND MOBILITY MEANS INCLUDING SAME
The plastic intermediate film includes a sound insulating layer, wherein the sound insulating layer comprises a polyvinyl acetal resin, a plasticizer, and a refractive index regulator, wherein the refractive index regulator is particles with average diameter (D.sub.50) of 100 nm or less and has an absolute refractive index of 2.0 or more, wherein the refractive index regulator is comprised in an amount of more than 0 wt % and 1 wt % or less based on the entire sound insulating layer, and wherein the plasticizer is comprised in an amount of 33 to 41 wt % based on the entire sound insulating layer.
RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME
A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I),
##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.
Polymer film and laminate
An object of the present invention is to provide a polymer film having a low dielectric loss tangent and a small difference in a linear expansion coefficient from that of a copper foil; and a laminate. The polymer film of an embodiment of the present invention is a polymer film including a liquid crystal polymer, in which a hardness A at a distance of half of a thickness of the polymer film and a hardness B at a distance of 1/10 of the thickness of the polymer film satisfy a relationship of Expression (1A), and in a case where positions at distances of 1/10, 4/10, and 6/10 of the thickness of the polymer film are defined as a position T1, a position T2, and a position T3, respectively; and a region from the one surface to the position T1 is defined as a first surface layer region, and a region from the position T2 to the position T3 is defined as a central region, a void area proportion X in the first surface layer region and a void area proportion Y in the central region satisfy a relationship of Expression (2A).
(Hardness A+Hardness B)/2≥0.10 GPa Expression (1A)
Void area proportion Y−Void area proportion X≥0.10% Expression (2A)
Bionic Laminated Thermal Insulation Material
The invention discloses a bionic laminated thermal insulation material, which imitates a multi-thin laminated and thin-layer micro-pore structure of Sequoia sempervirens bark with fire resistance, corrosion resistance and excellent thermal insulation performance. A low thermal conductivity microporous powder is used as main raw material, while reinforcing agent, plasticizer and porosity agent are added to form microporous thin-layer units, and each thin-layer unit is bonded and laminated to make a laminated thermal insulation material. The thermal conductivity of the finished products is as low as 0.02˜0.05 W/m.Math.k, with good thermal insulation and mechanical properties, which can be used in a temperature range below 1000° C., with better thermal insulation and energy-saving effect and toughness than ordinary thermal insulation materials, significantly reducing the thickness of the insulation layer, and can be widely used in industrial furnaces, thermal engineering devices, insulation pipes and other fields.
Polymeric Membrane Useful As A Commercial Roofing Membrane
The present disclosure provides a polymeric membrane. The polymeric membrane includes a first thermoplastic elastomer layer that comprises a styrenic thermoplastic. The thermoplastic elastomer layer has a foam structure. The polymeric membrane can further include an optional second thermoplastic elastomer layer in contact with the first polyolefin layer.