A rubber resin material with high thermal conductivity and low dielectric properties and a metal substrate using the same are provided. The rubber resin material includes a rubber resin composition and at least one surface-modified inorganic filler. The rubber resin composition includes 30 wt % to 60 wt % of a liquid rubber, 10 wt % to 40 wt % of a polyphenylene ether resin, and 10 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 2500 g/mol to 6000 g/mol. The at least one surface-modified inorganic filler has one or more modifying functional groups that are selected from the group consisting of an acrylic group, a functional group having a nitrogen-containing main or branched chain, a double bond-containing functional group, and an epoxy group.

A heat-conducting sheet 1 comprising a first heat-conducting layer 1a and a second heat-conducting layer 1b, which each comprise a polymer matrix 2 and an anisotropic filler 3, and wherein the anisotropic filler is oriented in a thickness direction. The first and second heat-conducting layers 1a and 1b are laminated via an interface 5 in which a filling ratio of the anisotropic filler 3 is lower than that of the first and second heat-conducting layers 1a and 1b.

Described herein are fire hoses incorporating new combinations of materials to increase the hose's resilience. Resilient hoses include those made with silicone-coated fabrics or with thermally-resistant fabrics or both.

The present invention has an object of providing an ethylene/-olefin/non-conjugated polyene copolymer composition excellent in the adhesive strength with a layer of a saponified ethylene/vinyl acetate copolymer; and the present invention relates to a laminate comprising a layer of a copolymer composition comprising 100 parts by mass of an ethylene/-olefin/non-conjugated polyene copolymer (A) and one or more additives selected from the following (1) to (3), and a layer of the saponified ethylene/vinyl acetate copolymer (B). (1) 1.7 to 20 parts by mass of dicumyl peroxide and 2 to 20 parts by mass of a metal oxide; (2) 20 to 120 parts by mass of a hydrophilic fumed silica; and (3) 5 to 50 parts by mass of an ethylene/vinyl acetate copolymer (B).

A solar radiation shielding laminated structure, having high visible light transmission property and solar radiation shielding property, low haze value, and high environmental stability with inexpensive production cost, using solar radiation shielding fine particles having high visible light transmission property and excellent solar shielding property and weather resistance, and provides a solar radiation shielding laminated structure in which an interlayer is sandwiched between two laminated sheets; the interlayer having, as an intermediate film, one or more kinds selected from a resin sheet containing solar radiation shielding fine particles and a resin film containing solar radiation shielding fine particles, the laminated sheets being selected from a sheet-glass not containing solar radiation shielding fine particles and a resin board not containing solar radiation shielding fine particles; wherein the solar radiation shielding fine particles are solar radiation shielding fine particles containing calcium lanthanum boride fine particles represented by general formula CaxLa1-xBm.

A high-frequency dielectric heating adhesive sheet includes: a first bonding layer containing a first thermoplastic resin and a first dielectric filler; and a second bonding layer containing a second thermoplastic resin and a second dielectric filler. A volume content VA1 of the first thermoplastic resin in the first bonding layer and a volume content VA2 of the second thermoplastic resin in the second bonding layer are in a range from 60% by volume to 100% by volume. Change rates Vx1 and Vx2 represented by formulas below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first bonding layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second bonding layer. (Formula 1): Vx1={(VA1VB 1)/VA1}100 (Formula 2): Vx2=1(VA2VB2)/VA2100

Disclosed herein are an antimicrobial reinforced floor and a method for preparing the same. In the method, a substrate and an impregnated paper impregnated with an inorganic antimicrobial agent and an organic antimicrobial agent are subjected to hot press forming to produce the antimicrobial reinforced floor.

This bonded structure includes a first member having a metal portion and a film portion disposed on at least a part of a surface of the metal portion; a second member; an adhesive layer for joining the first member and the second member to each other via the film portion. The film portion contains a resin and inorganic particles. The inorganic particles are formed of ferrosilicon or non-oxide ceramics containing V. Some of the inorganic particles protrude toward the adhesive layer. The particle size of at least some of the inorganic particles protruding toward the adhesive layer is less than the film thickness of the film portion.

A high-frequency-dielectric-heating adhesive configured to bond three or more adherends is provided. The high-frequency-dielectric-heating adhesive contains a thermoplastic resin and a dielectric filler configured to generate heat upon application of a high-frequency electric field. MVR of the high-frequency-dielectric-heating adhesive in a range from a lower-limit temperature TL to an upper-limit temperature TU is in a range from 1 to 300 cm.sup.3/10 min, where the lower-limit temperature TL (unit: degrees C.) is defined by a numerical formula (Numerical Formula 11) below and the upper-limit temperature TU (unit: degrees C.) is defined by a numerical formula (Numerical Formula 12) below,

TL=(softening temperature TM of the high-frequency-dielectric-heating adhesive)+10 degrees C.(Numerical Formula 11)

TU=(thermal decomposition temperature TD of the high-frequency-dielectric-heating adhesive)10 degrees C.(Numerical Formula 12).

A sustainable nonwoven fabric having at least one spunbond layer 30 comprising biodegradable polymer fibres of polylactic acid or a derivative thereof and a biodegradable binder and optionally including an antimicrobial agent within the binder. One or more additional layers (30, 32) of blended plant-derived fibres and/or biodegradable polymer fibres are included in the fabric which are laminated together.