Embodiments of the present disclosure are directed to multilayer articles including a metal layer, a thermally conductive hybrid layer overlaying the metal layer, and a thermally conductive continuous fiber composite layer overlaying the thermally conductive hybrid layer. The thermally conductive hybrid layer includes a polymer matrix with glass or ceramic and a first thermally conductive material disposed therein.

Described herein is an antiviral face mask and methods of use thereof to inactivate a virus in contact with the face mask. The face mask may include a fibrous material with silicon nitride powder impregnated therein and a layer surrounding the fibrous material. In some embodiments, silicon nitride is present in the fibrous material at a concentration of about 30 wt. % to about 50 wt. %.

An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

Deformable structures suitable for serving as a thermal gasket may comprise a deformable metal body having a uniform nanoporosity of about 40% to about 75% by volume, in which the deformable metal body is freestanding and formed from a plurality of metal nanoparticles that are partially consolidated together with each other. A thermal interface may be established by placing a thermal gasket defined by the deformable structures between a heat source and a heat sink. A pressurizing load may be established upon the thermal gasket, optionally by mechanically coupling the thermal gasket to a heat sink.

The application relates to a brake pad for a disk brake system and to a disk brake system. The proposed brake pad comprises a back plate having a front side for facing a brake disk of the disk brake system and a friction layer arranged on the front side of the back plate for contacting a friction surface of the brake disk. The brake pad further comprises an underlayer arranged between the front side of the back plate and the friction layer. The back plate comprises a recess. The underlayer extends into the recess of the back plate.

Provided is a bonding material that even in low-temperature bonding at 250 C. or lower, enables bonding with sufficient bonding strength and with low tendency for unevenness between a sinter state of a central section and a sinter state of a pressed edge section at a pressure bonding surface. A sheet-shaped bonding material contains copper particles and a reductant that reduces the copper particles. The copper particles include fine copper particles having a mean particle diameter of 300 nm or less and optionally include coarse copper particles having a mean particle diameter of 3-11 m. Content of the fine copper particles relative to the total content of the fine copper particles and the coarse copper particles is 50-100 mass %. The reductant is composed of triethanolamine, and content of the triethanolamine is 1.5-10.0 mass % relative to the total content of the fine copper particles and the coarse copper particles.