A debonding apparatus includes a debonder and a controller that are located inside an object including multiple adhered members adhered by an adhesive member. The debonder is configured to be operatable to debond the adhesive member by acting on the adhesive member. The controller is configured to activate the debonder, based on a debonding instruction received from a terminal apparatus located outside the object.

Disclosed is a method of electrochemical delamination of polymeric films from metallic articles. Also disclosed are systems for achieving the same.