The present invention relates to a composition comprising: a) one or more organometallic compounds: b) one or more high boiling point solvents; and c) one or more low boiling point, solvents. The invention further relates to a system comprising a) one or more organometallic compounds; b) ones or more high boding point solvents: and c) one or more low boiling point solvents and an isocyanate functional adhesive. The isocyanate functional adhesive may be a one part or a two-part adhesive. The invention further relates to methods of bonding substrates together using the compositions of the invention.

An adaptable heating source includes an insulating substrate. A plurality of heating elements are at least partially disposed within the insulating substrate. The plurality of heating elements, when energized, generate heat. Each heating element of the plurality of heating elements includes a ferromagnetic material and an electrically conductive material. The ferromagnetic material has a Curie temperature. When the plurality of heating elements are energized, the plurality of heating elements generate heat at a temperature that does not exceed the Curie temperature. An alternating current energizes the plurality of heating elements to generate heat at the temperature that does not exceed the Curie temperature.