The disclosure relates to a method for coating of a floor panel and a floor panel produced by the method. The disclosure relates to a method for producing a laminated product, for example a building panel, preferably a floor panel. The method comprises applying a paper on one side of a wood fiber based core, e.g. an HDF panel, creating a d?cor on the paper by a digital printing process, applying a resin, preferably a melamine formaldehyde resin, on the paper, heating the d?cor and the paper with the resin, preferably by using an IR lamp; and applying heat and pressure in order to cure the resin and thereby obtain a laminated product. The disclosure also relates to alternative methods for producing a laminated product, and such a laminated product.

A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

The present invention relates to drying processes for composite films comprising a polyvinyl acetal on a carrier as well as to composite films and polyvinyl acetal films obtained in such processes.

The present invention relates to a method for adhesively bonding substrates in film form, wherein one of the substrates has a thermoplastic surface which is converted into a softened state prior to adhesive bonding, and wherein the surface of this substrate that is opposite to the thermoplastic surface is cooled using a cooling roller. Furthermore, the present invention relates to a device for carrying out the method according to the invention.

Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

The present invention relates to a method for preparing a continuous carbon fiber-reinforced thermoplastic prepreg, and more specifically, to a method for preparing a continuous carbon fiber-reinforced thermoplastic semi-prepreg or prepreg, comprising the steps of: providing a plurality of carbon fibers having an increased width; preparing a layered product by arranging a thermoplastic film on at least a part of the upper and lower portions of the carbon fibers having an increased width; and preparing a joined product by joining the thermoplastic film and the carbon fibers comprising the layered body.

A method for producing a veneered building panel is provided. The method comprising: providing a substrate (1), applying a sub-layer (2) comprising a no added formaldehyde (NAF) binder on a first surface (4) of the substrate (1), applying a wood veneer layer (3) on the sub-layer (2), and applying heat and pressure to form said veneered building panel. The method further comprises dehydrating the wood veneer layer (3), prior to applying heat and pressure to form said veneered building panel, wherein dehydrating the wood veneer layer (3) comprises one or more of applying IR radiation, heat, microwaves and/or hot air to the wood veneer layer (3).

A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.

A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.