Patent classifications
B32B2310/0825
METHOD OF MANUFACTURING A FOOTWEAR
A method of manufacturing a footwear includes the steps of providing a leather base layer and providing a leather attachment layer. The leather base layer and the leather attachment layer are fixed against each other with an intermediate application of adhesive between them. The applied adhesive is activated. The leather base layer and the leather attachment layer are forced against each other under a pressure with the adhesive between them. The adhesive is cured and thereby the leather base layer and the leather attachment layer are bonded to each other. The bonded leather base layer and the leather attachment layer are integrated as part of the footwear.
Nano urethane acrylic with primer coated on a wood board or veneer bonded to PVC sheeting for interior and exterior application
A composite laminate system for indoor and outdoor applications, comprising a wood layer comprised of a thin plank or veneer. An aqueous, penetrating primer is applied in a first coating to all surfaces of the wood layer, and the primer is designed to prevent and resist decay from bio attack, insects and other intrinsic bacteria, featuring antibacterial and mold inhibiting properties, including a UV inhibitor. A first aqueous nano urethane acrylic coating is applied on all surfaces of the wood layer on top of the primer coating. At least a second aqueous nano urethane acrylic coating is applied to a top surface of the wood layer on top of the first aqueous nano urethane acrylic coating. A polyvinyl chloride (PVC) foam sheeting layer is glued to the wood layer with coatings using a resin adhesive glue layer interposed between the PVC foam sheeting and the wood layer.
SEALED DEVICES COMPRISING TRANSPARENT LASER WELD REGIONS
Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.
PANEL AND METHODS FOR MANUFACTURING PANELS
A panel may include at a substrate and a top layer provided on the substrate. The top layer may include a motif and a transparent or translucent synthetic material layer provided above the motif. The motif may be a print formed by digitally applying inks on the substrate with the intermediary of one or more primer layers extending underneath the print. The transparent or translucent synthetic material layer may include polypropylene and have a thickness of less than 1 millimeter.
INTERMEDIATE TRANSFER MEMBER
An intermediate transfer member (ITM) for use with a printing system, the ITM having (a) a support layer; and (b) a release layer having an ink reception surface and a second surface opposing the ink reception surface, the second surface attached to the support layer, the release layer formed of an addition-cured, hydrophobic silicone material, wherein the release surface of the release layer has relatively hydrophilic properties with respect to the addition-cured, hydrophobic silicone material.
FLOOR PANEL
A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.
FLOOR PANEL
A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.
Floor panel
A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.
Floor panel
A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.
USE OF RED TO NEAR-INFRARED HEAT-GENERATING ORGANIC DYES FOR REPROCESSING/RECYCLING POLYMERS
The present invention relates to a process for bringing a polymer composition above a threshold temperature on demand, wherein: the polymer composition comprises 0,01 to 0,5% weight of at least one heat-generating organic dye that generates heat above the threshold temperature when exposed to a given range of red to near-infrared irradiation, and the process comprises exposing the polymer composition to red to near-infrared irradiation at a wavelength within the red to near-infrared range where the heat-generating organic dye generates heat above the threshold temperature, the weight % being expressed with respect to the total weight of the polymer composition. The threshold temperature may be the glass transition temperature, the depolymerization temperature, the melting temperature, or the decomposition temperature of the polymer composition. The invention also relates to the use of a heat-generating organic dye adsorbing in the red to near-infrared, for reshaping a thermoplastic polymer article; bonding together two thermoplastic polymer or elastomer articles; separating two pieces of a thermoplastic polymer or elastomer article; self-healing or self-repairing a thermoplastic polymer article; recycling a composite polymer composition; recycling or depolymerizing a polymer; and/or separating