A shaped object includes a thermally expandable sheet including (i) a base, (ii) a thermal expansion layer disposed on a first surface of the base and including a thermally expandable material, and (iii) a thermal conversion member disposed on at least one of a second surface of the base or the thermal expansion layer, and including a thermal conversion material for conversion of electromagnetic waves into heat. The thermal conversion member further includes thermal conversion layers disposed on an entire region corresponding to an expansion region for expansion of the thermal expansion layer. At least part of one of the thermal conversion layers is disposed at a location separated from an adjacent other thermal conversion layer. Upon expansion of the thermal expansion layer, (i) the thermal expansion layer partially peels away from the thermal expansion layer in a region where the thermal conversion layer is disposed, and (ii) the thermal expansion layer also expands in a region between the one thermal conversion layer and the other thermal conversion layer.

Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.

A method of manufacturing a building panel with a decorative surface layer, a core and a balancing and/or protective layer, wherein the method includes applying a first layer of a first powder based mix, including wood fibres and a thermosetting binder, on a core; applying a liquid substance on the first powder based mix; drying the first powder based mix; turning the core with the dried first powder based mix such that the first powder based mix points downwards; applying a second layer on the upper part of the core; and curing the first and second layers by providing heat and pressure, wherein the first layer forms the balancing and/or protective layer and the second layer forms the decorative surface layer in the building panel.

A panel may include a substrate and a top layer provided on the substrate. The top layer may include a printed motif provided on a paper sheet and a transparent or translucent synthetic material layer. The paper sheet may be impregnated with polyurethane or polyisocyanate. The synthetic material of the transparent or translucent synthetic material layer may be polyurethane.

An intermediate transfer member (ITM) for use with a printing system, the ITM having (a) a support layer; and (b) a release layer having an ink reception surface and a second surface opposing the ink reception surface, the second surface attached to the support layer, the release layer formed of an addition-cured, hydrophobic silicone material, wherein the release surface of the release layer has relatively hydrophilic properties with respect to the addition-cured, hydrophobic silicone material.

The present disclosure is generally directed to a primer saturated carrier medium assembly including a carrier medium having a front face and an opposing rear face, a primer saturating the carrier medium between the front face and the opposing rear face, and removable film impenetrable to the primer covering opposite faces of the carrier medium. A method of applying primer to a surface includes applying a face of a primer saturated carrier medium to contact a surface, and curing the primer saturated carrier medium on the surface. A structure includes a primer saturated medium including a carrier medium having a front face and an opposing rear face, and a primer saturating the carrier medium between the front face and the opposing rear face. The structure further includes a surface adhered to the primer on one face of the primer saturated medium.

A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.

A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.

A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.

The invention relates to a method for adhering flexible substrates, the connecting adhesive layer being formed in a thin manner. The invention further relates to a composite substrate, wherein the two substrates are connected by a thin flexible adhesive layer.