A method of manufacturing a semiconductor device may include bonding a carrier substrate onto a device wafer using an adhesive member, wherein the adhesive member includes a base film, a device adhesive film disposed on a lower surface of the base film and contacting the device wafer, and a carrier adhesive film disposed on an upper surface of the base film and contacting the carrier substrate. The device adhesive film includes a gas blowing agent, and the carrier adhesive film may not include a gas blowing agent.

The invention relates to on-demand debondable pressure sensitive adhesive and laminating adhesive compositions and uses thereof. The debondable pressure sensitive adhesives and laminating adhesives are applied onto a substrate to form a bond, and upon exposure to electron beam or UV light energy source, the adhesive can dissociate from the substrate. The debondable pressure sensitive adhesives and laminating adhesives are particularly suitable for recycling in a circular economy.

Apparatus, compositions, and systems for ultraviolet (UV) heat-activated laminating adhesives applied via an inkjet printing process are disclosed. A system includes a first inkjet mechanism configured to deposit ink in a particular pattern onto a surface of a rigid medium. A second inkjet mechanism is configured to deposit a laminating adhesive onto the particular pattern printed on the surface of the rigid medium. A pair of stainless steel plates is configured to receive an overlay film layer and the laminating adhesive deposited onto the particular pattern printed on the surface of the rigid medium. The overlay film layer is positioned such that a surface of the overlay film layer faces the laminating adhesive. Pressure and heat are applied to the overlay film layer and the laminating adhesive to laminate the particular pattern printed on the surface of the rigid medium.

A laminated body for polishing a back surface of a wafer, the laminated body including an intermediate layer that is disposed between a support and a circuit surface of the wafer and peelably adheres to the support and the circuit surface, wherein the intermediate layer includes an adhesion layer in contact with the wafer and a peeling layer in contact with the support, and the peeling layer contains a novolac resin that absorbs light with a wavelength of 190 nm to 600 nm incident through the support, resulting in modification. The light transmittance of the peeling layer at a wavelength range of 190 nm to 600 nm may be 1 to 90%. The modification caused by absorption of light may be photodecomposition of the novolac resin.

A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.

A winding assembly for a protective device of a motor vehicle, and a method for producing such a winding assembly. Such a winding assembly includes a form-stable winding shaft and a flexible winding web held on the winding shaft such that it can be wound up and unwound. The winding shaft is formed by a form-stabilized wound-up first portion of a flexible sheet-form material and the flexible winding web is formed by a second portion of the flexible sheet-form material adjoining the first portion, whereby the winding shaft and the winding web are in continuous one-piece form.

The present disclosure relates to a method to produce a coating layer, including applying a coating composition on a surface of a carrier, curing the coating composition to a coating layer, and subsequently applying pressure to the coating layer. The disclosure further relates to a method to produce a building panel, and such a building panel, and to a method to produce a coated foil, and such a coated foil.

A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.

A touch panel, a touch display panel, and an attaching method of a glass cover are provided. The touch panel includes a touch control layer provided with an adhesive layer on an upper surface, and a glass cover disposed on the touch control layer and connected to the touch control layer by the adhesive layer; wherein a side of the glass cover facing the touch control layer provided with an ink layer, a plurality of meshes is disposed on the ink layer allowing ultraviolet light to pass through to irradiate and cure the adhesive layer.

The invention relates to a decorative panel, comprising at least one substrate comprising an upper surface and a bottom surface and two pairs of opposing side edges, wherein the substrate comprises at least one core layer and at least one decorative layer and the panel comprising at least one coating layer, wherein the coating layer is provided upon the upper surface of the substrate, wherein both the upper surface of the substrate and the upper coating surface of the coating layer have a predetermined Shore D hardness.