A lift-off method for transferring an optical device layer in an optical device wafer to a transfer substrate, the optical device layer being formed on the front side of an epitaxy substrate through a buffer layer. A transfer substrate is bonded through a bonding layer to the front side of the optical device layer of the optical device wafer, thereby forming a composite substrate. A pulsed laser beam having a wavelength transmissive to the epitaxy substrate and absorptive to the buffer layer is applied from the back side of the epitaxy substrate to the buffer layer, thereby breaking the buffer layer, and the epitaxy substrate is peeled from the optical device layer, thereby transferring the optical device layer to the transfer substrate. Ultrasonic vibration is applied to the composite substrate in transferring the optical device layer.

A printed gas sensor is disclosed. The sensor may include a partially porous substrate, an electrode layer, an electrolyte layer, and an encapsulation layer. The electrode layer comprises one or more electrodes that are formed on one side of the porous substrate. The electrolyte layer is in electrolytic contact with the one or more electrodes. The encapsulation layer encapsulates the electrode layer and electrolyte layer thereby forming an integrated structure with the partially porous substrate.

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

Methods and devices for producing a composite pane having a functional coating are presented. The functional coating is applied to part of a surface of a base pane, and a first pane is cut out from the base pane while introducing a frame-shaped peripheral coating-free region into the functional coating having an inner region that is not adjacent a side edge of the first pane. The surface of the first pane with the functional coating is then bonded via a thermoplastic intermediate layer to a surface of a second pane.

A display device including a folding area includes a display panel, a cover window disposed above the display panel, and a protective film disposed on the cover window, where the protective film includes a first region and a second region including a same material as each other and having different moduli from each other. A modulus of the second region of the protective film is less than a modulus of the first region, and the second region is disposed in the folding area.

A composite transparent conducting film (TCF) on a substrate that includes a first region extending to a first depth of the TCF and having a higher density (lower porosity) than a second region of the TCF located at a different depth of the TCF. A method of forming the composite TCF includes applying a transparent conducting layer onto a substrate or onto a second layer previously formed on the substrate, and rapidly heating the transparent conducting layer resulting in a first region extending to a first depth of the transparent conducting layer that is at least partially melted and of a higher density (lower porosity) than a second region located at a different depth of the transparent conducting layer that is not melted, thereby forming a composite TCF that has a change of porosity in a thickness direction of the composite TCF.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Methods of making a transparent glass-based article including at least two transparent glass-based substrates and a laser-induced bond therebetween. Methods include arranging the two transparent glass-based substrates relative to each other to form a contact area. Methods also include providing a laser beam contiguous the contact area to bond the two transparent glass-based substrates.

A method for manufacturing a liquid crystal aligning film includes preparing a multilayer structure in which a substrate, a conductive layer, a liquid crystal alignment layer, and a passivation film are sequentially provided, etching one area of the liquid crystal alignment layer by irradiating a pulse laser to the multilayer structure, and exposing one area of the conductive layer by removing the passivation film, wherein the pulse laser is irradiated to the liquid crystal alignment layer from the passivation film. The method is compatible with a continuous process.

A method of making a component of an electric machine using an additive manufacturing process is disclosed. The method includes forming a first lamina of a conductive material, building a first layer of a second material on a first surface of the first lamina, treating the second material on the first surface of the first lamina to define a first insulative layer, and building on the first insulative layer a second lamina of a conductive material. The steps can be repeated iteratively until a desired thickness or number of layers is reached.