B32B2310/0843

BONDED ARTICLES AND METHODS FOR FORMING THE SAME

A bonded article includes a first substrate, a second substrate, and a bonding layer disposed between the first substrate and the second substrate. The bonding layer includes a conducting layer and a capping layer. The first substrate is bonded to the second substrate at a bonded region extending along a bond track. The bonded region is substantially continuous between the first substrate and the second substrate.

Anti-Graffiti Laminate with Visual Indicia
20230374846 · 2023-11-23 · ·

An anti-graffiti window film covering system that includes multiple polymeric film layers. Each layer includes a unique visual indicia to identify the number of sheets remaining in the system.

Laser transmissive compositions and related methods
11518868 · 2022-12-06 · ·

Embodiments of the present disclosure include laser transmissive compositions and related methods. The laser transmissive compositions may include one or more of the following components: (a) a polyester compound; (b) a filler; (c) a non-aromatic organic nucleating agent; (d) at least one of a chain extender and a branching agent, wherein the chain extender/branching agent includes two or more reactive groups attached thereto; (e) at least one heat stabilizer; (f) at least one process stabilizer; (g) at least one lubricant; and (h) one or more further additives.

Four D device process and structure

A 4D device comprises a 2D multi-core logic and a 3D memory stack connected through the memory stack sidewall using a fine pitch T&J connection. The 3D memory in the stack is thinned from the original wafer thickness to no remaining Si. A tongue and groove device at the memory wafer top and bottom surfaces allows an accurate stack alignment. The memory stack also has micro-channels on the backside to allow fluid cooling. The memory stack is further diced at the fixed clock-cycle distance and is flipped on its side and re-assembled on to a template into a pseudo-wafer format. The top side wall of the assembly is polished and built with BEOL to fan-out and use the T&J fine pitch connection to join to the 2D logic wafer. The other side of the memory stack is polished, fanned-out, and bumped with C4 solder. The invention also comprises a process for manufacturing the device. In another aspect, the invention comprises a 4D process and device for over 50× greater than 2D memory density per die and an ultra high density memory.

METHOD FOR PRODUCING AN ADHESIVE BOND AND SUPPORT PLATE FOR PRODUCING AN ADHESIVE BOND
20220274348 · 2022-09-01 ·

The invention relates to a method for producing an adhesive bond between at least a first and a second, at least partially transparent planar component, in which the first component is laid onto a support plate, and an adhesive is applied to the first component at specified locations on the side of the first component facing away from the support plate, and the second component is laid onto the first component and is held parallel to the first component at a predefined distance, in such a way that the second component comes into contact with the adhesive on the first component.

Packaging film having direct food contact identifiers and method of making thereof

Method for producing a packaging film strip for providing a number of individual packaging film parts for packing food or beverages, wherein the packaging film contains for each designated individual packaging film part an area having a printed two-dimensional code as unique packaging or product identifier. The process comprises the steps of providing at least one first substrate film strip (10, 25), applying on one side of said at least one first substrate film strip (10, 25) an artwork printing (20) for each individual packaging film part, depositing a DFC ink area (28) for each individual packaging film part onto the surface of the substrate film strip (10, 12) lying opposite to the artwork printing (20), slitting the packaging film to provide a series of individual packaging film parts running along the longside of the packaging film, ablating the individual DFC ink areas (28) by a computer-controlled laser beam (8) for providing a predetermined and individual code (2, 3, 30) as unique packaging or product identifier, cleaning the surface of the film strip comprising the individual codes (2, 3, 30), and checking the quality of the codes (2, 3, 30).

DISPLAY MODULE, AND METHOD FOR MANUFACTURING THE SAME
20220250347 · 2022-08-11 · ·

A display module includes a display panel including a first side surface, a first film disposed on the display panel, and including a second side surface, a second film disposed under the display panel, and including a third side surface, a first adhesive layer disposed between the display panel and the first film, and a second adhesive layer disposed between the display panel and the second film, wherein the first side surface of the display panel overlaps the first film and the second film, and at least a portion of the second side surface and at least a portion of the third side surface protrude more than the first side surface, in a plan view.

Light permeable vehicle interior panel

A vehicle interior panel includes a decorative layer formed from a material that blocks transmission of a range of wireless communication frequencies. Perforations are formed through the material so that the decorative layer permits wireless communication through the panel. The perforations may be formed in a pattern so that an illuminated pattern is displayed at a decorative side of the panel when backlit. The perforations can be made non-visible and enable the use of carbon fiber and other conductive materials in the decorative layer without sacrificing wireless communication capability.

Peeling method and method of manufacturing semiconductor device

There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a layer to be peeled having a large area can be peeled over the entire surface at a high yield. Processing for partially reducing contact property between a first material layer (11) and a second material layer (12) (laser light irradiation, pressure application, or the like) is performed before peeling, and then peeling is conducted by physical means. Therefore, sufficient separation can be easily conducted in an inner portion of the second material layer (12) or an interface thereof.

METAL, CERAMIC, OR CERAMIC-COATED TRANSACTION CARD WITH WINDOW OR WINDOW PATTERN AND OPTIONAL BACKLIGHTING
20220101080 · 2022-03-31 · ·

A transaction card includes at least one metal layer having one or more apertures therein. A light guide is disposed beneath the metal layer. The light guide has a light output and a light input. The light output is positioned to transmit light through at least the one or more apertures of the metal layer. At least one LED is positioned to transmit light into the light guide light input