A RF weldable film is provided. The film has outer layer including a PVDF copolymer or an alpha-olefin polymer and backing layer including a TPU copolymer. The film may have a gas barrier layer attached to the backing layer. The backing layer may include an EVOH copolymer. A method of making such a film is also provided. Containers made from such film are further provided.

The present invention relates generally to a protective wrap and a protective envelope or pouch made therefrom, as well as the apparatus and process for forming such wraps and envelopes. Water-based heat-expandable adhesives (WBHEA) which include a plurality of heat-expandable microspheres are disposed in a pattern between web substrates on a continuous, high speed manufacturing line to produce padded, insulated products useful as envelopes, mailers and other protective packaging.

An article may include a first polymeric material layer having a surface. A first conductive trace may form at least a portion of the first layer surface. The article may further include a second polymeric material layer. The second layer may have a first surface, a portion of the second layer first surface being bonded to a portion of the first layer surface. The second layer may have a portion of a channel defined therein, the channel at least partially coinciding with a portion of the first conductive trace. The article may also include a first patch interposed between the first layer surface and the second layer first surface. The first patch may span the channel and cover a portion of the first conductive trace.