A printing method for carrying out printing with respect to various printing target objects through a more appropriate method using an inkjet head, the printing method including a screen preparing step of preparing a mesh-like screen, an ink discharging step of discharging an ink droplet from the inkjet head to one surface of the screen, a viscosity increasing step of enhancing a viscosity of the ink on the screen, an ink push-in step of pushing the ink with enhanced viscosity from the one surface side toward other surface side of the screen, the step including pushing in the ink while a medium, or a target object of printing, and the other surface of the screen are making contact to attach the ink with enhanced viscosity to the medium, and an ink fixing step of fixing the ink attached to the medium to the medium.

A printing method for carrying out printing with respect to various printing target objects through a more appropriate method using an inkjet head, the printing method including a screen preparing step of preparing a mesh-like screen, an ink discharging step of discharging an ink droplet from the inkjet head to one surface of the screen, a viscosity increasing step of enhancing a viscosity of the ink on the screen, an ink push-in step of pushing the ink with enhanced viscosity from the one surface side toward other surface side of the screen, the step including pushing in the ink while a medium, or a target object of printing, and the other surface of the screen are making contact to attach the ink with enhanced viscosity to the medium, and an ink fixing step of fixing the ink attached to the medium to the medium.

A solder supply device provided with a solder cup housing liquid solder that is tubular and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and an outer tube that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. Solder is supplied from the solder container without using an air cylinder, electromagnetic motor, or the like.

Solder supply device includes solder cup that is tubular and open at one end, nozzle section for ejecting solder from the solder cup, flange section that is fixedly provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup, and inner tube an end of which holds the nozzle section and the other end of which extends from the opening of the solder cup; the flange section is formed from material that is elastically deformable and the flange section is engaged inside the cup with an outer edge section of the flange section in an elastically deformed state. The elastic force arising between the outer edge section of the flange section and the solder cup is smaller than the holding force of the nozzle section by the inner tube.

A paste supply apparatus includes a pot holding part that holds a paste pot that includes a tubular container which receives paste and is provided with a through hole in a bottom part of the tubular container and an inner lid movable inside the tubular container, in a posture in which the paste can be extruded downwardly from the through hole, an extrusion member configured to hold the inner lid of the paste pot held in the pot holding part, an inner lid holding part with which the inner lid is held in the extrusion member, an extrusion member elevation part that upwardly and downwardly moves the extrusion member, and a stopper with which the container upwardly moved together with the inner lid collides when the extrusion member holding the inner lid is pulled up by the extrusion member elevation part.

A system for forming a particle layer on a substrate may include at least one sprayer and at least two masks configured to selectively mask a substrate in a first region and second region of the substrate. The at least one sprayer may be configured to spray particles at the substrate, where the at least two masks maintain the first region and second region substantially free of the deposited material. A heater may be employed to heat the substrate as the particles are sprayed by the at least one sprayer onto the substrate.

Described are systems, methods, devices, apparatuses, and materials suitable for fabricating flexible microcavity structures and integrating flexible microcavity structures into multi-functional flexible hybrid electronics and electronic components, as well as systems, devices, apparatuses, methods, and computer program products for screen-printing flexible microcavity structures and for integrating flexible microcavity structures into multi-functional flexible hybrid electronics.

The present application provides a solder paste dispensing feedback system (10) for a circuit board printer. The system (10) comprises a solder paste container (101), a solder paste extruding device, a first sensor, a second sensor and a control device. The solder paste container (101) is used to contain solder paste and has an outlet. The solder paste extruding device is used to extrude the solder paste from the outlet of the solder paste container (101). The first sensor is used to detect solder paste in the solder paste container (101), and generate a first signal to indicate whether the solder paste container (101) still contains solder paste. The second sensor is used to detect an operating state of the solder paste container (101), and generate a second signal to indicate whether solder paste is extruded from the outlet of the solder paste container (101). The control device is used to receive the first signal and the second signal, and control the operation of the circuit board printer according to the indications of the first signal and the second signal.