The supply unit is used in a printing device including a printing head configured to perform printing process of a viscous fluid on a printing target using a screen mask, a collection section having a collection member configured to contact the screen mask to collect and move the viscous fluid and a collecting and moving section configured to move the collection member in a predetermined printing direction. The supply unit includes a supply section having a mounting section capable of mounting and dismounting a cartridge accommodating the viscous fluid, a driving section configured to move the supply section in the supply operation direction, a detection member, and a supply section detecting section configured to detect whether the supply section is positioned in a passage space where the collection section and the supply section do not contact each other by the position of the detection member.

Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.

Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

A screen printing apparatus includes a squeegee driver that lifts/lowers a first lifting/lowering shaft and a second lifting/lowering shaft; a link mechanism including a swinging member that pivots about a horizontal axis by lifting/lowering operations of the first lifting/lowering shaft and the second lifting/lowering shaft; a squeegee unit installed to the swinging member; and a controller that controls at least a height of the squeegee unit and an orientation of the squeegee unit in a rotating direction by controlling the squeegee driver.

A screen printing apparatus includes a squeegee driver that lifts/lowers a first lifting/lowering shaft and a second lifting/lowering shaft; a link mechanism including a swinging member that pivots about a horizontal axis by lifting/lowering operations of the first lifting/lowering shaft and the second lifting/lowering shaft; a squeegee unit installed to the swinging member; and a controller that controls at least a height of the squeegee unit and an orientation of the squeegee unit in a rotating direction by controlling the squeegee driver.

Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

A solder paste printer for which a pressing force of squeegee towards a stencil when spreading solder paste is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.

A solder paste printer for which a pressing force of squeegee towards a stencil when spreading solder paste is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.