The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a surface on which a number of nozzles are formed. An electrical interface on the fluidic die establishes an electrical connection between the fluidic die and a fluidic die controller. The electrical interface includes 1) a bond pad disposed within a bond pad region of the surface and 2) an electrical lead coupled to the bend pad to establish an electrical connection between the fluidic die and the fluidic die controller. The fluidic die also includes a beveled edge along an edge of the surface underneath the electrical lead.

A liquid jet discharge device including an ejection section, a pressure generation section, and an impulse force impartation means. The ejection section is open at both end portions and internally houses a liquid such that a contact angle between the liquid and at least an inner face of the ejection section is less than 90°. The pressure generation section is in communication with one end portion of the ejection section, has a cross-sectional area larger than a cross-sectional area of the ejection section, has a length in a discharge direction of a liquid jet that is longer than a length in the discharge direction from the one end portion of the ejection section to a surface of the liquid, and houses the liquid at least at a bottom face side onto which the one end portion opens. The impulse force impartation means is configured to impart an impulse force to the pressure generation section.

A liquid jet discharge device including an ejection section, a pressure generation section, and an impulse force impartation means. The ejection section is open at both end portions and internally houses a liquid such that a contact angle between the liquid and at least an inner face of the ejection section is less than 90°. The pressure generation section is in communication with one end portion of the ejection section, has a cross-sectional area larger than a cross-sectional area of the ejection section, has a length in a discharge direction of a liquid jet that is longer than a length in the discharge direction from the one end portion of the ejection section to a surface of the liquid, and houses the liquid at least at a bottom face side onto which the one end portion opens. The impulse force impartation means is configured to impart an impulse force to the pressure generation section.

A first inflow port allows a first liquid to flow into a liquid flow passage, and a second inflow port allows a second liquid to flow into the liquid flow passage. The first and second liquids flow toward a pressure chamber. There is a portion satisfying L≥W, where L is a length of the first inflow port and W is a length of the liquid flow passage above the first inflow port, in a direction orthogonal to a direction of flow of the first liquid in the pressure chamber and to a direction of ejection of the second liquid from an ejection port. In a case where the second liquid is ejected from bottom to top, the second liquid flows above the first liquid.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.