Described herein is process for heat transfer printing, the process comprising: liquid electrostatically printing a liquid electrostatic ink composition on a polyether-based thermoplastic polyurethane film to form a printed film; and contacting the printed film with a target substrate under conditions such that the printed film adheres to the target substrate. Also described herein is a process for printing a heat transferable printed image and a heat transferable printed image.

Described herein is a process for heat transfer printing, the process comprising: electrostatically printing a transparent release composition onto a transfer material to form a release layer disposed on the transfer material; electrostatically printing an electrostatic ink composition on the release layer to form an image layer disposed on the release layer; contacting a thermoplastic film with the image layer; contacting the thermoplastic film with a target substrate under conditions such that the thermoplastic film adheres to the target substrate and the release layer is softened; and separating the target substrate and the transfer material such that the thermoplastic film, image layer and release layer are transferred to the target substrate. A heat transferrable printed image is also

A liquid discharge head includes a recording element substrate. The recording element substrate includes a discharge aperture forming member defining a discharge aperture from which a liquid is discharged and a substrate having a pressure generating element that pressurizes the liquid so as to discharge the liquid. The liquid discharge head also includes a cover member that defines an opening through which the discharge aperture is exposed. The cover member is disposed on a side of the recording element substrate on which the discharge aperture is formed. In the liquid discharge head, the recording element substrate further includes an electrode disposed on a side of the substrate on which the discharge aperture forming member is formed and an insulation member that covers the electrode. In addition, the insulation member is covered by the cover member.

A thermal printer, includes a head unit including a thermal head configured to perform printing on a recording sheet; a platen unit, which includes a platen roller configured to convey the recording sheet, and is separably combined with the head unit; a printer main body, which has a recording-sheet receiving portion configured to receive the recording sheet, and has the head unit mounted thereto; a printer cover, which has the platen unit mounted thereto, and is coupled to the printer main body so as to be pivotable; and a separator, which is provided in the recording-sheet receiving portion, and is configured to separate parts of the recording sheet, which is rolled into a roll shape around a core body, folded on each other at a rolling start portion, which is rolled around the core body and has a turn-back shape.

A printer includes a print head that performs printing on a recording medium, a frame, a platen roller attached to the frame, a head spring that biases the print head toward the platen roller, a hook provided on a facing surface of the frame facing a back surface of the print head, and a support provided at an end of the head spring and attached to the hook. The head spring is rotatable about the support.

A printer includes a print head that performs printing on a recording medium, a frame, a platen roller attached to the frame, a head spring that biases the print head toward the platen roller, a hook provided on a facing surface of the frame facing a back surface of the print head, and a support provided at an end of the head spring and attached to the hook. The head spring is rotatable about the support.

A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.

A head pressurizing mechanism in which in a state in which a first tape cartridge is mounted, a first contact pin is positioned at a first switching position in which the first contact pin comes in contact with a pressure receiving portion provided on a side of a thermal head opposite a platen roller, and in a state in which the second tape cartridge is mounted, by pushing the pressurizing position switching portion in a mounting direction with the second tape cartridge, a second contact pin is positioned at a second switching position in which the second contact pin comes in contact with the pressure receiving portion at, with respect to the first switching position, a portion in a direction opposite the mounting direction.

The present application provides a fixation structure for a thermal printing head, and the fixation structure comprises a first circuit board, a first fixation member disposed on one side of the first circuit board, and a second circuit board. A first slot is formed between the first fixation member and the first circuit board. A first limited member and a second limited member are disposed on both ends of the first fixation member with a first protruded member and a second protruded member disposed slidably on one side of both respectively. The second circuit board is disposed slidably between the first limited member and the second limited member and inserted to the first slot. This structure facilitates rapid installation of circuit boards. Furthermore, a first locking slot may be capable of rotating and disposed inside the first fixation member for providing rapid installation of circuit boards.

The present disclosure provides a printer apparatus including a thermoelectric cooling assembly and a processor coupled to the thermoelectric cooling assembly. The thermoelectric cooling assembly includes a thermoelectric cooling element that includes a first substrate, a second substrate, and a first plurality of semiconductor elements electrically coupled to a second plurality of semiconductor elements in a space between the first substrate and the second substrate. The thermoelectric cooling element includes a base plate electrically coupled to the first substrate. The base plate is positioned proximate to a plurality of labels traversing above the thermoelectric cooling assembly. The processor receives sensor signals indicative of a temperature of a label that comes in contact with the thermoelectric cooling assembly, compares the temperature of the label with a threshold temperature, and generates an output signal indicative of current supplied to the thermoelectric cooling element to adjust the temperature of the thermoelectric cooling element.