Printhead carriers and adapters are disclosed. An example disclosed print mechanism includes an adapter to simultaneously couple a printhead assembly to both a logic circuit of a media processing device and a power source of the media processing device; a printhead carrier coupled to the adapter; and wherein a first connection, between data input connector and the logic circuit, and a second connection, between the power input connector and the power source, are maintained when the printhead assembly is removed from the print mechanism.

The present disclosure provides a method for manufacturing a thermal print head. The method includes: forming an electrode layer on a substrate; and forming a resistor layer including a plurality of heat generating portions connected to the electrode layer. The electrode layer includes a plurality of individual electrodes including a plurality of first striped portions extending in a secondary scan direction and spaced apart in a main scan direction, and a common electrode including a plurality of second striped portions extending in the secondary scan direction. The forming of the resistor layer includes: a coating process of applying a resistor paste in a stripe that overlaps the first striped portions and the second striped portions; a firing process of firing the resistor paste to form a resistor film; and a removal process of removing a removal region in the resistor paste or the resistor film.

The present disclosure provides a method for manufacturing a thermal print head. The method includes: forming an electrode layer on a substrate; and forming a resistor layer including a plurality of heat generating portions connected to the electrode layer. The electrode layer includes a plurality of individual electrodes including a plurality of first striped portions extending in a secondary scan direction and spaced apart in a main scan direction, and a common electrode including a plurality of second striped portions extending in the secondary scan direction. The forming of the resistor layer includes: a coating process of applying a resistor paste in a stripe that overlaps the first striped portions and the second striped portions; a firing process of firing the resistor paste to form a resistor film; and a removal process of removing a removal region in the resistor paste or the resistor film.

A thermal print head includes a substrate, a resistor layer and a wiring layer. The substrate is made of a single crystal semiconductor and includes an obverse surface facing in one sense of a thickness direction. The resistive layer is supported by the substrate and includes a plurality of heat generating parts arranged side by side in a main scanning direction. The wiring layer is supported by the substrate and forms a conductive path to the plurality of heat generating parts. The wiring layer includes a conductive part and a heat generating sub-part for each of the plurality of heat generating parts, where the conductive part has a lower resistance value per unit length in a sub-scanning direction than the heat generating part, and where the heat generating sub-part has a resistance value per unit length in the sub-scanning direction that falls between the respective resistance values of the heat generating part and the conductive part. The substrate includes a ridge raised from the obverse surface and extending in the main scanning direction. The heat generating part, the heat generating sub-part and the conductive part are disposed on the ridge. The heat generating sub-part is located between the heat generating part and the conductive part in the sub-scanning direction.

A thermal head includes a substrate, a heat-generating portion disposed on the substrate, electrodes disposed on the substrate and electrically connected to the heat-generating portion, a driver IC disposed on the substrate and electrically connected to the electrodes, and a covering member covering the driver IC. In plan view, a center line of the driver IC extending in a main scanning direction and a highest position of the covering member are located farther form the heat-generating portion than a center line of the covering member extending in the main scanning direction.

An element substrate, comprises: a plurality of printing elements configured to discharge liquid; a plurality of first driving elements disposed in correspondence with the plurality of printing elements and configured to drive the plurality of printing elements; a plurality of heating elements configured to heat the element substrate; a plurality of second driving elements disposed in correspondence with the plurality of heating elements and configured to drive the plurality of heating elements; and a delay unit that delays timing of driving the plurality of second driving elements to drive the plurality of second driving elements at a predetermined time difference when driving the plurality of second driving elements simultaneously.

Provided is a thermal print head including: a substrate having a convex part thereon; a wiring layer over the convex part; a heat storage layer over the wiring layer; a heating resistive part that is formed over the heat storage layer and is arranged along a main scanning direction; a first electrode in contact with the heating resistive part on one side in a sub-scanning direction; a second electrode in contact with the heating resistive part on another side in the sub-scanning direction; and a connection wiring formed in an opening that passes through the heating resistive part and the heat storage layer and reaches the wiring layer, in which the first electrode is electrically connected to the wiring layer via the connection wiring.

A thermal print head includes: a head substrate on which a plurality of heating resistance units are formed; a heat sink thermally connected to the head substrate, a recess being formed in a back surface of the heat sink which faces a surface to which the head substrate is connected; a metal member arranged in the recess; and an adhesive arranged between a bottom surface of the recess and the metal member. The recess viewed from a direction perpendicular to the back surface includes: an area where the metal member is arranged, and a groove area where the metal member is not arranged. A portion of the adhesive is arranged in the groove area.

A thermal print head includes: a head substrate on which a plurality of heating resistance units are formed; a heat sink thermally connected to the head substrate, a recess being formed in a back surface of the heat sink which faces a surface to which the head substrate is connected; a metal member arranged in the recess; and an adhesive arranged between a bottom surface of the recess and the metal member. The recess viewed from a direction perpendicular to the back surface includes: an area where the metal member is arranged, and a groove area where the metal member is not arranged. A portion of the adhesive is arranged in the groove area.

Examples of the present disclosure relate generally to a printing apparatus and, more particularly, to apparatuses, systems, and methods for printing utilizing laser print head and reactive media.