The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer.

A thermal head includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. Further, a kurtosis Rku of the protective layer is smaller than 3. A thermal head includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. Further, a skewness Rsk of the protective layer is smaller than 0.

A thermal head includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. Further, a kurtosis Rku of the protective layer is smaller than 3. A thermal head includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. Further, a skewness Rsk of the protective layer is smaller than 0.

A thermal head of the present disclosure includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. A skewness Rsk of the protective layer is larger than 0. Further, A thermal head of the present disclosure includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. A kurtosis Rku of the protective layer is larger than 3.

A thermal head of the present disclosure includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. A skewness Rsk of the protective layer is larger than 0. Further, A thermal head of the present disclosure includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. A kurtosis Rku of the protective layer is larger than 3.

Printhead carriers and adapters are disclosed. An example disclosed printhead carrier includes a base to carry a printhead assembly; a first pivot mechanism to pivot the base about a first axis; and a second pivot mechanism to pivot a connector about a second axis different than the first axis, the printhead assembly to be removably coupled to the connector.

Printhead carriers and adapters are disclosed. An example disclosed printhead carrier includes a base to carry a printhead assembly; a first pivot mechanism to pivot the base about a first axis; and a second pivot mechanism to pivot a connector about a second axis different than the first axis, the printhead assembly to be removably coupled to the connector.

A thermal head for a thermal transfer machine is provided to transfer a film onto a card. The thermal head may include a frame intended to be secured to the machine. The thermal head may also include a heating bar mounted on the frame, intended to create heat and having a heating surface designed to diffuse said heat towards the outside. The thermal head may yet also include a pad produced from a flexible material and fixed removably against the heating surface so as to be placed between the heating surface and the film.

A thermal head for a thermal transfer machine is provided to transfer a film onto a card. The thermal head may include a frame intended to be secured to the machine. The thermal head may also include a heating bar mounted on the frame, intended to create heat and having a heating surface designed to diffuse said heat towards the outside. The thermal head may yet also include a pad produced from a flexible material and fixed removably against the heating surface so as to be placed between the heating surface and the film.

[Object] To provide a thermal head that can reduce the probability of breakage of a connector.

[Solution] A thermal head X1 includes a substrate 7; a plurality of heating elements 9 disposed on the substrate 7; a plurality of electrodes disposed on the substrate 7 and electrically connected to the plurality of heating elements 9; a connector 31 disposed adjacent to the substrate 7 and including a plurality of connector pins 8a including connection portions 32, each of which is electrically connected to a corresponding one of the plurality of electrodes, and a housing 10 containing the plurality of connector pins 8a; and a covering member 12 covering the connection portions on the substrate. The housing includes an opening facing away from the substrate. The covering member 12 includes a first portion 12a located on the substrate 7 and a second portion 12b located on the housing 10. The second portion 12b includes a first protrusion 12b1 protruding toward the opening 10i in a plan view. Thus, the probability of breakage of the connector can be reduced.