To prevent an insufficient development density of pixels with which a high-density image is recorded. Thermal energy to be applied to a pixel of interest is increased if a pixel immediately subsequent to the pixel of interest is one to which energy not causing heat propagation to the pixel of interest is applied.

A method operates a thermal printer to print on thermal paper. A thermo-reactive layer of the paper forms a first color at a first temperature and a second color at a second, higher temperature. The printer has a printhead with heat sources arranged next to one another transversely to a paper path. The heat sources are selectively controllable. The method includes: a transport roller line by line moving the paper past the printhead; and in each line of the paper, heating selected heat sources. At points at which the second color is formed on the paper, a plurality of adjacent heat sources is heated to a printing temperature. At points at which the first color is to be formed on the paper, a portion of a plurality of the adjacent heat sources is heated to the printing temperature, and the other portion of the adjacent heat sources is not heated.

A method operates a thermal printer to print on thermal paper. A thermo-reactive layer of the paper forms a first color at a first temperature and a second color at a second, higher temperature. The printer has a printhead with heat sources arranged next to one another transversely to a paper path. The heat sources are selectively controllable. The method includes: a transport roller line by line moving the paper past the printhead; and in each line of the paper, heating selected heat sources. At points at which the second color is formed on the paper, a plurality of adjacent heat sources is heated to a printing temperature. At points at which the first color is to be formed on the paper, a portion of a plurality of the adjacent heat sources is heated to the printing temperature, and the other portion of the adjacent heat sources is not heated.

A thermal head includes a head base, a wiring board, a plurality of recessed portions, a contact portion, a plurality of drive ICs, a plurality of wire members, and a resin member. The head base includes a substrate. The wiring board is located adjacent to the head base. The plurality of recessed portions are located adjacent to the head base. The contact portion is located between the recessed portions adjacent to each other, and the substrate and the wiring board are in contact with each other at the contact portion. The plurality of drive ICs are located on the first surface of the wiring board so as to face one by one the plurality of recessed portions. The plurality of wire members are located across the recessed portions and electrically connect the substrate and the drive ICs. The resin member seals the plurality of wire members and the plurality of drive ICs.

A thermal head includes a head base, a wiring board, a plurality of recessed portions, a contact portion, a plurality of drive ICs, a plurality of wire members, and a resin member. The head base includes a substrate. The wiring board is located adjacent to the head base. The plurality of recessed portions are located adjacent to the head base. The contact portion is located between the recessed portions adjacent to each other, and the substrate and the wiring board are in contact with each other at the contact portion. The plurality of drive ICs are located on the first surface of the wiring board so as to face one by one the plurality of recessed portions. The plurality of wire members are located across the recessed portions and electrically connect the substrate and the drive ICs. The resin member seals the plurality of wire members and the plurality of drive ICs.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each ink-drop generator includes a barrier layer, an ink-supply chamber and a nozzle. The ink-supply chamber and the nozzle are integrally formed in the barrier layer.

According to one embodiment, a printer includes an input interface and a processor. The input interface inputs a distance signal output from a distance sensor opposite to a rotating surface of a roll around which a sheet material is wound in a roll shape. The processor detects an amount of change in a distance from the distance sensor to the rotating surface of the roll based on a plurality of distance signals input at different timings, detects a vibration convergence state of the roll from the amount of change in the distance, and detects a diameter of the roll based on the distance signal input in the vibration convergence state.

A thermal printer includes: a platen having a rotatable columnar shape and configured to convey a print medium having various widths by bringing the print medium into contact with an outer peripheral portion of the platen, a central portion of the platen in a direction of a rotary shaft of the platen being taken as a reference; and a print head facing the platen, pressed by the outer peripheral portion, and configured to print by applying heat to the print medium sandwiched between the print head and the outer peripheral portion. In the outer peripheral portion of the platen, a first groove is formed in a direction intersecting the direction of the rotary shaft in each of second outer peripheral portions on both outer sides in the direction of the rotary shaft with respect to a first outer peripheral portion in contact with the print medium having a smallest width that can be conveyed.

A thermal printer includes: a platen having a rotatable columnar shape and configured to convey a print medium having various widths by bringing the print medium into contact with an outer peripheral portion of the platen, a central portion of the platen in a direction of a rotary shaft of the platen being taken as a reference; and a print head facing the platen, pressed by the outer peripheral portion, and configured to print by applying heat to the print medium sandwiched between the print head and the outer peripheral portion. In the outer peripheral portion of the platen, a first groove is formed in a direction intersecting the direction of the rotary shaft in each of second outer peripheral portions on both outer sides in the direction of the rotary shaft with respect to a first outer peripheral portion in contact with the print medium having a smallest width that can be conveyed.

A printer including thermal head, a platen including a shaft, a pair of bushing, a bracket, a pair of frames, and a pair of supports. The bushings are positioned proximate opposing ends of the shaft. The bracket is configured to support the thermal head. The bracket defines a groove at opposing ends thereof. The frames are positioned proximate the opposing ends of the bracket. Each of the frames defines an aperture that cooperates with the groove to define a passage through which a portion of the shaft extends. Each of the supports is positioned to engage with the aperture of a respective one of the frames. The supports are rotatable within the apertures about an axis of rotation. The supports are positioned to support the opposing ends of the shaft such that the shaft is eccentric from the axis of rotation.