A thermal head includes a substrate; a plurality of heat generating portions; a common electrode disposed on the substrate and electrically connected to the plurality of heat generating portions; a plurality of individual electrodes disposed on the substrate and each electrically connected to a corresponding one of the plurality of heat generating portions; a first insulation layer disposed on the heat generating portions, a part of the common electrode, and a part of the individual electrodes; a second insulation layer located adjacent to the first insulation layer and disposed on a part of the individual electrodes; and a static removing layer disposed on the first insulation layer and grounded. The static removing layer includes a first portion disposed on an upper surface of the first insulation layer and a second portion electrically connected to the first portion and disposed on an upper surface of the second insulation layer.

A thermal print head includes a heat-generating substrate, a resistor layer, a conductive layer, a first substrate, a second substrate, and a third substrate. The heat-generating substrate includes a heat-generating substrate obverse face and a heat-generating substrate reverse face that are spaced apart from each other in a thickness direction. The resistor layer is supported by the heat-generating substrate. The conductive layer is supported by the heat-generating substrate, and electrically connected to the resistor layer. The first substrate is located upstream of the heat-generating substrate in a sub-scanning direction. The second substrate is located upstream of the first substrate in the sub-scanning direction. The third substrate is bonded to the first substrate and the second substrate and higher in flexibility than the first substrate.

A thermal print head includes a heat-generating substrate, a resistor layer, a conductive layer, a first substrate, a second substrate, and a third substrate. The heat-generating substrate includes a heat-generating substrate obverse face and a heat-generating substrate reverse face that are spaced apart from each other in a thickness direction. The resistor layer is supported by the heat-generating substrate. The conductive layer is supported by the heat-generating substrate, and electrically connected to the resistor layer. The first substrate is located upstream of the heat-generating substrate in a sub-scanning direction. The second substrate is located upstream of the first substrate in the sub-scanning direction. The third substrate is bonded to the first substrate and the second substrate and higher in flexibility than the first substrate.

A thermal head includes a head base, a wiring board, a plurality of recessed portions, a contact portion, a plurality of drive ICs, a plurality of wire members, and a resin member. The head base includes a substrate. The wiring board is located adjacent to the head base. The plurality of recessed portions are located adjacent to the head base. The contact portion is located between the recessed portions adjacent to each other, and the substrate and the wiring board are in contact with each other at the contact portion. The plurality of drive ICs are located on the first surface of the wiring board so as to face one by one the plurality of recessed portions. The plurality of wire members are located across the recessed portions and electrically connect the substrate and the drive ICs. The resin member seals the plurality of wire members and the plurality of drive ICs.

A thermal head includes a head base, a wiring board, a plurality of recessed portions, a contact portion, a plurality of drive ICs, a plurality of wire members, and a resin member. The head base includes a substrate. The wiring board is located adjacent to the head base. The plurality of recessed portions are located adjacent to the head base. The contact portion is located between the recessed portions adjacent to each other, and the substrate and the wiring board are in contact with each other at the contact portion. The plurality of drive ICs are located on the first surface of the wiring board so as to face one by one the plurality of recessed portions. The plurality of wire members are located across the recessed portions and electrically connect the substrate and the drive ICs. The resin member seals the plurality of wire members and the plurality of drive ICs.

A thermal print head includes a heat-generating substrate, a resistor layer, a conductive layer, a first substrate, a second substrate, and a third substrate. The heat-generating substrate includes a heat-generating substrate obverse face and a heat-generating substrate reverse face that are spaced apart from each other in a thickness direction. The resistor layer is supported by the heat-generating substrate. The conductive layer is supported by the heat-generating substrate, and electrically connected to the resistor layer. The first substrate is located upstream of the heat-generating substrate in a sub-scanning direction. The second substrate is located upstream of the first substrate in the sub-scanning direction. The third substrate is bonded to the first substrate and the second substrate and higher in flexibility than the first substrate.

A thermal print head includes a heat-generating substrate, a resistor layer, a conductive layer, a first substrate, a second substrate, and a third substrate. The heat-generating substrate includes a heat-generating substrate obverse face and a heat-generating substrate reverse face that are spaced apart from each other in a thickness direction. The resistor layer is supported by the heat-generating substrate. The conductive layer is supported by the heat-generating substrate, and electrically connected to the resistor layer. The first substrate is located upstream of the heat-generating substrate in a sub-scanning direction. The second substrate is located upstream of the first substrate in the sub-scanning direction. The third substrate is bonded to the first substrate and the second substrate and higher in flexibility than the first substrate.

A thermal head includes a substrate, electrodes, and a resistor layer. The electrodes are located on the substrate and extend along a first direction of the substrate in a plan view. The resistor layer is located on the substrate and on the electrode. The electrodes include a first electrode and a second electrode arranged at a predetermined interval in a second direction intersecting the first direction. In at least one of the first electrode and the second electrode, a central portion in the second direction protrudes out farther than an end portion in the second direction on the upper surface located below the resistor layer.

A thermal head includes a substrate, electrodes, and a resistor layer. The electrodes are located on the substrate and extend along a first direction of the substrate in a plan view. The resistor layer is located on the substrate and on the electrode. The electrodes include a first electrode and a second electrode arranged at a predetermined interval in a second direction intersecting the first direction. In at least one of the first electrode and the second electrode, a central portion in the second direction protrudes out farther than an end portion in the second direction on the upper surface located below the resistor layer.

The present disclosure provides a method for manufacturing a thermal print head. The method includes: forming an electrode layer on a substrate; and forming a resistor layer including a plurality of heat generating portions connected to the electrode layer. The electrode layer includes a plurality of individual electrodes including a plurality of first striped portions extending in a secondary scan direction and spaced apart in a main scan direction, and a common electrode including a plurality of second striped portions extending in the secondary scan direction. The forming of the resistor layer includes: a coating process of applying a resistor paste in a stripe that overlaps the first striped portions and the second striped portions; a firing process of firing the resistor paste to form a resistor film; and a removal process of removing a removal region in the resistor paste or the resistor film.