A method for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate is provided. A first side of a dye carrier sheet having an image formed thereon of a dye sublimation ink is placed on a second side of the plastic substrate to form a stack. A first side of a textured cover is placed on a side of the stack. A clamping pressure is provided on the textured cover and the stack, wherein the stack and textured cover are clamped together. The stack is heated to at least a sublimation temperature of the stack, which causes the dye sublimation ink to sublimate and penetrate through the second side of the plastic substrate, creating a dye sublimation image in the plastic substrate and wherein texture from the textured cover is transferred to a side of the plastic substrate.

Various of the disclosed embodiments concern printing systems configured to deposit flexible dye sublimation inks onto flexible transfer materials. Together, the flexible ink and transfer material allow images to be transferred onto complex-shaped, i.e. non-planar, surfaces of a substrate. The flexible ink may be, for example, a thermoformable UV dye sublimation ink or a superflexible UV dye sublimation ink. In order to transfer an image onto the substrate, the transfer material is pressed onto the surface of the substrate. The substrate, transfer material, or both are heated to a temperature sufficient to cause the ink to sublimate. During the sublimation process, dye is able to permeate the substrate and form a transferred image. The flexible ink formulation may also include a soluble or solvent-sensitive component. In such embodiments, a solvent can be jetted onto the substrate and/or transfer material to remove residual ink.

A method for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate is provided. A first side of a dye carrier sheet having an image formed thereon of a dye sublimation ink is placed on a second side of the plastic substrate to form a stack. A first side of a textured cover is placed on a side of the stack. A clamping pressure is provided on the textured cover and the stack, wherein the stack and textured cover are clamped together. The stack is heated to at least a sublimation temperature of the stack, which causes the dye sublimation ink to sublimate and penetrate through the second side of the plastic substrate, creating a dye sublimation image in the plastic substrate and wherein texture from the textured cover is transferred to a side of the plastic substrate.

Building panels, especially floor panels, and a method of forming embossed in register surfaces with a digital ink head that applies a curable ink on the panel surface or on an upper side of a foil as a coating and forms an ink matrix that is used to create a cavity in the surface by applying a pressure on the ink matrix.

A method for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate is provided. A first side of a dye carrier sheet having an image formed thereon of a dye sublimation ink is placed on a second side of the plastic substrate to form a stack. A first side of a textured cover is placed on a side of the stack. A clamping pressure is provided on the textured cover and the stack, wherein the stack and textured cover are clamped together. The stack is heated to at least a sublimation temperature of the stack, which causes the dye sublimation ink to sublimate and penetrate through the second side of the plastic substrate, creating a dye sublimation image in the plastic substrate and wherein texture from the textured cover is transferred to a side of the plastic substrate.

Building panels, especially floor panels, and a method of forming embossed in register surfaces with a digital ink head that applies a curable ink on the panel surface or on an upper side of a foil as a coating and forms an ink matrix that is used to create a cavity in the surface by applying a pressure on the ink matrix.

An apparatus for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate, wherein the plastic substrate has a first side and a second side, is provided. A textured cover is on a side of a platen, wherein the platen is on a first, untextured side of the textured cover. A first side of the dye carrier is on a second, textured side of the textured cover, and wherein the plastic substrate is supported on a second side of the dye carrier, wherein a first side of the plastic substrate is supported by the dye carrier, wherein the textured side of the textured cover has a texture to be transferred to the plastic substrate. A membrane is on the second side of the plastic substrate. A vacuum pump provides a vacuum between the membrane and the platen. A heater is positioned to heat the plastic substrate.

Various of the disclosed embodiments concern printing systems configured to deposit flexible dye sublimation inks onto flexible transfer materials. Together, the flexible ink and transfer material allow images to be transferred onto complex-shaped, i.e. non-planar, surfaces of a substrate. The flexible ink may be, for example, a thermoformable UV dye sublimation ink or a superflexible UV dye sublimation ink. In order to transfer an image onto the substrate, the transfer material is pressed onto the surface of the substrate. The substrate, transfer material, or both are heated to a temperature sufficient to cause the ink to sublimate. During the sublimation process, dye is able to permeate the substrate and form a transferred image. The flexible ink formulation may also include a soluble or solvent-sensitive component. In such embodiments, a solvent can be jetted onto the substrate and/or transfer material to remove residual ink.

Building panels, especially floor panels, and a method of forming embossed in register surfaces with a digital ink head that applies a curable ink on the panel surface or on an upper side of a foil as a coating and forms an ink matrix that is used to create a cavity in the surface by applying a pressure on the ink matrix.

A panel includes a thermoset material, and an image comprising sublimation ink. The sublimation ink is absorbed in the thermoset material. The rigid component may be a rigid structure formed by the thermoset material. The panel may be for a bath or shower enclosure.