A method of manufacturing an image pattern for a security device includes providing a metallised substrate; applying a first photosensitive resist layer to a substrate first metal layer exposing the resist layer to radiation; exposing the resist layer to a first reactant substance; activating a cross linking agent in the resist layer; exposing first and second pattern elements of the resist layer to radiation of a wavelength to which the resist layer is responsive whereupon newly-exposed first pattern elements of the first photosensitive resist layer react, resulting in increased solubility by the second etchant substance, the second pattern elements remaining relatively insoluble by the second etchant substance; and applying first and second etchant substances to the substrate whereupon the first pattern elements of both the first resist layer and the first metal layer are dissolved, the remaining second pattern elements of the first metal layer forming an image pattern.

A method of manufacturing an image pattern for a security device includes providing a metallised substrate; applying a first photosensitive resist layer to a substrate first metal layer exposing the resist layer to radiation; exposing the resist layer to a first reactant substance; activating a cross linking agent in the resist layer; exposing first and second pattern elements of the resist layer to radiation of a wavelength to which the resist layer is responsive whereupon newly-exposed first pattern elements of the first photosensitive resist layer react, resulting in increased solubility by the second etchant substance, the second pattern elements remaining relatively insoluble by the second etchant substance; and applying first and second etchant substances to the substrate whereupon the first pattern elements of both the first resist layer and the first metal layer are dissolved, the remaining second pattern elements of the first metal layer forming an image pattern.

The present invention describes methods and apparatuses for creating superposition shape images by superposed base and revealing layers of lenslet gratings. The superposition shape images form a message recognizable by a human observer or by an image acquisition and computing device such as a smartphone. The superposition shape images may be created by different superposition techniques ranging from 1D moir, 2D moir and level-line moir superposition techniques to lenticular image and phase shift superposition techniques. Moir superposition techniques enable creating superposition shape images at different apparent depth levels. Applications comprise the protection of documents and valuable articles against counterfeits, the creation of eye-catching advertisements as well as the decoration of buildings and exhibitions.

The present invention describes methods and apparatuses for creating superposition shape images by superposed base and revealing layers of lenslet gratings. The superposition shape images form a message recognizable by a human observer or by an image acquisition and computing device such as a smartphone. The superposition shape images may be created by different superposition techniques ranging from 1D moir, 2D moir and level-line moir superposition techniques to lenticular image and phase shift superposition techniques. Moir superposition techniques enable creating superposition shape images at different apparent depth levels. Applications comprise the protection of documents and valuable articles against counterfeits, the creation of eye-catching advertisements as well as the decoration of buildings and exhibitions.

A method for producing a multi-layer body, in particular a security element, in which a partial first layer or partial first layer system is produced on a substrate, wherein the partial first layer or partial first layer system is present in a first partial area and not in a second partial area. Subsequently, a partial second layer or partial second layer system is produced, wherein the partial second layer or partial second layer system is present in a third partial area and not in a fourth partial area, and wherein the third partial area overlaps with the first and second partial areas. Finally, the partial first layer or partial first layer system is structured as a mask using the partial second layer or partial second layer system.

A method for producing a multi-layer body, in particular a security element, in which a partial first layer or partial first layer system is produced on a substrate, wherein the partial first layer or partial first layer system is present in a first partial area and not in a second partial area. Subsequently, a partial second layer or partial second layer system is produced, wherein the partial second layer or partial second layer system is present in a third partial area and not in a fourth partial area, and wherein the third partial area overlaps with the first and second partial areas. Finally, the partial first layer or partial first layer system is structured as a mask using the partial second layer or partial second layer system.

A method for marking a product (1) with a photoluminescent mark, said mark comprising a photoluminescent portion (10) which is transparent under normal light conditions and revealed by photoluminescence under UV illumination, said mark further comprising a non photoluminescent portion (9) which is transparent under normal light conditions as well s under UV illumination, said method comprising: deposing on said product a stack, said stack comprising alternatively layers (2,4) such as AIN, with a thickness of less than 1 micron and layers (3) of a second material, such as GaN with a thickness of less than 10 nm; raising the transparency of said non photoluminescent portion (10) with a deposition of transparent material (6) or incorporation of ions into said non photoluminescent portions.

A method for marking a product (1) with a photoluminescent mark, said mark comprising a photoluminescent portion (10) which is transparent under normal light conditions and revealed by photoluminescence under UV illumination, said mark further comprising a non photoluminescent portion (9) which is transparent under normal light conditions as well s under UV illumination, said method comprising: deposing on said product a stack, said stack comprising alternatively layers (2,4) such as AIN, with a thickness of less than 1 micron and layers (3) of a second material, such as GaN with a thickness of less than 10 nm; raising the transparency of said non photoluminescent portion (10) with a deposition of transparent material (6) or incorporation of ions into said non photoluminescent portions.

A method for marking a product (1) with a photoluminescent mark, said mark comprising a photoluminescent portion (10) which is transparent under normal light conditions and revealed by photoluminescence under UV illumination, said mark further comprising a non photoluminescent portion (9) which is transparent under normal light conditions as well as under UV illumination, said method comprising: deposing on said product a stack, said stack comprising alternatively layers (2, 4), such as AlN, with a thickness of less than 1 micron and layers (3) of a second material, such as GaN, with a thickness of less than 10 nm; raising the transparency of said non photoluminescent portion (10) with a deposition of transparent material (6) or incorporation of ions into said non photoluminescent portions.

A method for marking a product (1) with a photoluminescent mark, said mark comprising a photoluminescent portion (10) which is transparent under normal light conditions and revealed by photoluminescence under UV illumination, said mark further comprising a non photoluminescent portion (9) which is transparent under normal light conditions as well as under UV illumination, said method comprising: deposing on said product a stack, said stack comprising alternatively layers (2, 4), such as AlN, with a thickness of less than 1 micron and layers (3) of a second material, such as GaN, with a thickness of less than 10 nm; raising the transparency of said non photoluminescent portion (10) with a deposition of transparent material (6) or incorporation of ions into said non photoluminescent portions.