The present disclosure is directed towards a security sheet (11) for displaying data (16). The security sheet (11) comprises a data sheet (15) for displaying data (16) and an attachment layer (17). The attachment layer (17) comprises a plurality of tabs (25) extending from an attachment portion (26) for attaching the data sheet (15) into a security document (10). The plurality of tabs (25) are attached to the data sheet (15) such that the attachment layer (17) is attached to and extends from the data sheet (15). The attachment layer (17) can comprise a textile.

An identification document including a multilayer laminate having a core layer defining an opening therethrough, and a dynamic window in the opening. The dynamic window includes an optically variable coating on at least a front or a back of the dynamic window. The optically variable coating appears transparent when viewed from the front of the identification document in light transmitted through the dynamic window from the back of the identification document toward the front of the identification document, and appears nontransparent when viewed from the front of the identification document in light reflected from the front of the identification document. Fabricating an identification document with a dynamic window includes forming an opening in a core layer, positioning a dynamic window in the opening, and plate laminating the core layer and the dynamic window between at least one outer layer on each side of the core layer.

A transfer method is provided and includes a disposing step of disposing a transfer sheet and a medium in an inside of a sealed space formed by using a pressure welding sheet having flexibility in at least one part; a pressure welding step of suctioning the inside of the sealed space by a negative pressure and pressure welding the pressure welding sheet and the medium by the negative pressure to closely attach the transfer sheet and the medium; an irradiating step of softening an adhesive layer of the transfer sheet by irradiation of a light ray in a state in which the transfer sheet is closely attached to the medium by the pressure welding sheet and adhering the adhesive layer to the medium by a pressure welding force from the pressure welding sheet; and a peeling step of peeling off the transfer sheet from the medium after the irradiating step.

A transfer method is provided and includes a disposing step of disposing a transfer sheet and a medium in an inside of a sealed space formed by using a pressure welding sheet having flexibility in at least one part; a pressure welding step of suctioning the inside of the sealed space by a negative pressure and pressure welding the pressure welding sheet and the medium by the negative pressure to closely attach the transfer sheet and the medium; an irradiating step of softening an adhesive layer of the transfer sheet by irradiation of a light ray in a state in which the transfer sheet is closely attached to the medium by the pressure welding sheet and adhering the adhesive layer to the medium by a pressure welding force from the pressure welding sheet; and a peeling step of peeling off the transfer sheet from the medium after the irradiating step.

A method is provided for producing banknotes, which include, in each case, at least one integrated circuit. The banknotes are produced from a sheet or from a material web in a production panel. In at least a plurality of these banknotes, or in each of these banknotes, an aperture is created through their substrate. In each case, an integrated circuit is arranged in the relevant aperture. In a first method step, each of the integrated circuits to be arranged in one of the apertures is arranged, with respect to the intended position in each of the banknotes that include an aperture, in the correct position on a band-shaped foil, and, in the second method step, each of these integrated circuits is transferred from this band-shaped foil onto the relevant banknote. Owing to this transfer carried out in the second method step, one integrated circuit in each case, is arranged in the aperture created in the banknotes.

A method is provided for producing banknotes, which include, in each case, at least one integrated circuit. The banknotes are produced from a sheet or from a material web in a production panel. In at least a plurality of these banknotes, or in each of these banknotes, an aperture is created through their substrate. In each case, an integrated circuit is arranged in the relevant aperture. In a first method step, each of the integrated circuits to be arranged in one of the apertures is arranged, with respect to the intended position in each of the banknotes that include an aperture, in the correct position on a band-shaped foil, and, in the second method step, each of these integrated circuits is transferred from this band-shaped foil onto the relevant banknote. Owing to this transfer carried out in the second method step, one integrated circuit in each case, is arranged in the aperture created in the banknotes.

Provided is a laminated body in which a print layer is provided downstream of a laser color development layer without lowering quality. A card is provided with an offset print layer laminated on a base material, a buffer layer laminated on the offset print layer and having translucency, and a laser color development layer laminated on the buffer layer. The buffer layer minimizes scratches on the offset print layer that occur with the heat generation of the laser color development layer.

Provided is a laminated body in which a print layer is provided downstream of a laser color development layer without lowering quality. A card is provided with an offset print layer laminated on a base material, a buffer layer laminated on the offset print layer and having translucency, and a laser color development layer laminated on the buffer layer. The buffer layer minimizes scratches on the offset print layer that occur with the heat generation of the laser color development layer.

The method for producing a microcircuit card including a film having a very low level of shrinkage between two overlay layers, carrying at least one electronic component and an assembly of layers in which a cavity is formed containing the film and the electronic component, involves: forming the assembly to include a central layer 16 made from a material having a very low level of shrinkage between two layers of a plastic material having a substantially higher level of shrinkage, for example PVC, forming, through the assembly, a cavity of which the surface area advantageously equals between 30% and 90% of the surface area of the outer faces of the microcircuit card that is to be produced, embedding the film and the electronic component in a resin so as to occupy the space in the cavity and laminating the two overlay layers.

The method for producing a microcircuit card including a film having a very low level of shrinkage between two overlay layers, carrying at least one electronic component and an assembly of layers in which a cavity is formed containing the film and the electronic component, involves: forming the assembly to include a central layer 16 made from a material having a very low level of shrinkage between two layers of a plastic material having a substantially higher level of shrinkage, for example PVC, forming, through the assembly, a cavity of which the surface area advantageously equals between 30% and 90% of the surface area of the outer faces of the microcircuit card that is to be produced, embedding the film and the electronic component in a resin so as to occupy the space in the cavity and laminating the two overlay layers.