A system is capable of generating identifications that include distinctive line patterns corresponding to different portions of secure customer information. In some implementations, data indicating one or more linear patterns and data indicating customer information to be embedded within an identification document is obtained. Respective subsets of the customer information are assigned to each of the one or more linear patterns. A photographic image to be included within the identification document is then modified based at least on generating a portion of the photographic image that is composed of at least one of the one or more linear patterns. The modified photographic image is then disposed on an identification document to yield embedded customer information.

A system is capable of generating identifications that include distinctive line patterns corresponding to different portions of secure customer information. In some implementations, data indicating one or more linear patterns and data indicating customer information to be embedded within an identification document is obtained. Respective subsets of the customer information are assigned to each of the one or more linear patterns. A photographic image to be included within the identification document is then modified based at least on generating a portion of the photographic image that is composed of at least one of the one or more linear patterns. The modified photographic image is then disposed on an identification document to yield embedded customer information.

A system and method are disclosed for providing integrated circuit (IC) chip modules for inclusion in payment objects. IC chip modules may be received from a supplier of IC chip modules, wherein the IC chip modules are supportably interconnected to a flexible substrate and transport key data is encoded in the IC chip modules. Each IC chip module may be encoded with personalization data and issuer key data. Encoding of IC chip modules may be completed utilizing either a contact IC chip interface device or a non-contact IC chip interface device. Encoding the IC chip modules may be completed with the IC chip modules supportably interconnected to the flexible substrate as supplied by the supplier of the IC chip modules, free from fixed interconnection of the IC chip modules and carrier to another support structure.

A system and method are disclosed for providing integrated circuit (IC) chip modules for inclusion in payment objects. IC chip modules may be received from a supplier of IC chip modules, wherein the IC chip modules are supportably interconnected to a flexible substrate and transport key data is encoded in the IC chip modules. Each IC chip module may be encoded with personalization data and issuer key data. Encoding of IC chip modules may be completed utilizing either a contact IC chip interface device or a non-contact IC chip interface device. Encoding the IC chip modules may be completed with the IC chip modules supportably interconnected to the flexible substrate as supplied by the supplier of the IC chip modules, free from fixed interconnection of the IC chip modules and carrier to another support structure.

A system and method for producing a multi-layered materials sheet that can be separated into a number of payment cards having an embedded metal layer that provides durability and aesthetics at a reduced cost and increased efficiency. During product of the materials sheet, multiple layers are collated and laminated to produce a large materials sheet. The lamination step involves heating and cooling the materials at specific temperatures and pressures for specific time periods. At a registration step, the sheet is automatically milled with alignment holes. During a singulation step, the alignment holes are used to position the sheet on a vacuum table, and vacuum holds the sheet in place while a milling device cuts cards from the sheet.

A system and method for producing a multi-layered materials sheet that can be separated into a number of payment cards having an embedded metal layer that provides durability and aesthetics at a reduced cost and increased efficiency. During product of the materials sheet, multiple layers are collated and laminated to produce a large materials sheet. The lamination step involves heating and cooling the materials at specific temperatures and pressures for specific time periods. At a registration step, the sheet is automatically milled with alignment holes. During a singulation step, the alignment holes are used to position the sheet on a vacuum table, and vacuum holds the sheet in place while a milling device cuts cards from the sheet.

A system and method are disclosed for providing integrated circuit (IC) chip modules for inclusion in payment objects. IC chip modules may be received from a supplier of IC chip modules, wherein the IC chip modules are supportably interconnected to a flexible substrate and transport key data is encoded in the IC chip modules. Each IC chip module may be encoded with personalization data and issuer key data. Encoding of IC chip modules may be completed utilizing either a contact IC chip interface device or a non-contact IC chip interface device. Encoding the IC chip modules may be completed with the IC chip modules supportably interconnected to the flexible substrate as supplied by the supplier of the IC chip modules, free from fixed interconnection of the IC chip modules and carrier to another support structure.

A system and method are disclosed for providing integrated circuit (IC) chip modules for inclusion in payment objects. IC chip modules may be received from a supplier of IC chip modules, wherein the IC chip modules are supportably interconnected to a flexible substrate and transport key data is encoded in the IC chip modules. Each IC chip module may be encoded with personalization data and issuer key data. Encoding of IC chip modules may be completed utilizing either a contact IC chip interface device or a non-contact IC chip interface device. Encoding the IC chip modules may be completed with the IC chip modules supportably interconnected to the flexible substrate as supplied by the supplier of the IC chip modules, free from fixed interconnection of the IC chip modules and carrier to another support structure.

A card manufacturing system includes a locating device and a separation device. A laminate sheet comprising a plurality of cards is received by the locating device and is imaged using first and second imaging modalities. The first imaging modality identifies a location of each of the plurality of information carrying cards within the laminate sheet and the second imaging modality images at least one graphic formed on a surface of the laminate sheet. A position of the at least one graphic with respect to at least one information carrying card is determined and the plurality of cards are removed from the laminate sheet using information corresponding to the location of each of the plurality of information carrying cards when the position of the at least one graphic with respect to the information carrying cards is within a predetermined range.

A card manufacturing system includes a locating device and a separation device. A laminate sheet comprising a plurality of cards is received by the locating device and is imaged using first and second imaging modalities. The first imaging modality identifies a location of each of the plurality of information carrying cards within the laminate sheet and the second imaging modality images at least one graphic formed on a surface of the laminate sheet. A position of the at least one graphic with respect to at least one information carrying card is determined and the plurality of cards are removed from the laminate sheet using information corresponding to the location of each of the plurality of information carrying cards when the position of the at least one graphic with respect to the information carrying cards is within a predetermined range.