Patent classifications
B60H2001/3248
Method for controlling air conditioner compressor
A method for controlling an air conditioner compressor includes: driving the air conditioner compressor for a first time at a first revolutions per minute (RPM) smaller than a minimum lubrication demand RPM when a lubrication demand RPM of the air conditioner compressor is smaller than the minimum lubrication demand RPM; and driving the air conditioner compressor for a second time at the minimum lubrication demand RPM when the lubrication demand RPM of the air conditioner compressor is smaller than the minimum lubrication demand RPM after the first time elapse.
Air conditioner, vehicle including the same, and method for controlling the air conditioner
An air-conditioner may include an evaporator, a compressor configured to compress refrigerant supplied to the evaporator and a clutch configured to transmit power needed to operate the compressor to the compressor or to prevent power from being supplied to the compressor, wherein the clutch prevents power from being supplied to the compressor when an actual measurement temperature of the evaporator reaches a lower limit threshold temperature selected among the lower limit threshold temperature and an upper limit threshold temperature and the lower limit threshold temperature is changeable, and the upper limit threshold temperature is relatively higher than the lower limit threshold temperature and is changeable.
INTERIOR ENVIRONMENT ADJUSTING DEVICE, VEHICLE WITH THE SAME, AND INTERIOR ENVIRONMENT ADJUSTING METHOD
The control part ECU of the interior environment adjusting device 1 for adjusting the environment inside the compartment C of the vehicle V1 executes adjustment to make inside air pressure that is air pressure inside the compartment C into positive pressure to outside air pressure that is air pressure around the vehicle V1 using oxygen-enriched air generated by the oxygen enrichment mechanism 21, and adjustment to make an oxygen concentration inside the compartment C to be a higher concentration than in the outside air.
Vehicle air-conditioning device
A vehicle air-conditioning device may achieve comfortable heating of a vehicle interior by starting a compressor, an indoor blower and heat generating means at appropriate timing. The vehicle air-conditioning device includes a compressor which compresses a refrigerant, a radiator disposed in an air flow passage to let the refrigerant radiate heat, a heat absorber which lets the refrigerant absorb heat, and an indoor blower which blows the air through the air flow passage. The vehicle interior is heated by heat radiated from the radiator. The vehicle air-conditioning device includes a heating medium-air heat exchanger of a heating medium circulating circuit disposed in the air flow passage to heat air supplied to the vehicle interior. On a basis of an outdoor air temperature, the timing to start the compressor, the indoor blower and the heating medium circulating circuit is controlled.
VEHICLE AIR-CONDITIONING DEVICE
A vehicle air-conditioning device may achieve comfortable heating of a vehicle interior by starting a compressor, an indoor blower and heat generating means at appropriate timing. The vehicle air-conditioning device includes a compressor which compresses a refrigerant, a radiator disposed in an air flow passage to let the refrigerant radiate heat, a heat absorber which lets the refrigerant absorb heat, and an indoor blower which blows the air through the air flow passage. The vehicle interior is heated by heat radiated from the radiator. The vehicle air-conditioning device includes a heating medium-air heat exchanger of a heating medium circulating circuit disposed in the air flow passage to heat air supplied to the vehicle interior. On a basis of an outdoor air temperature, the timing to start the compressor, the indoor blower and the heating medium circulating circuit is controlled.
Control system of flowing air into vehicle engine room and method for the same
The present disclosure relates to a system for controlling an air flow rate into a vehicle engine room. The system includes: an air intake port receiving an exterior air at a front portion of the vehicle and supplying the air into the engine room; air ducts formed at both sides of the air intake port and introduce the exterior air into a wheel side in order to improve aerodynamic characteristic; a control valve configured to selectively convey the air flowed in the air intake port into the air ducts; a radiator disposed between the air intake port and the engine room; and a control portion configured to control the control valve based on an operating state of vehicle. The air ducts are selectively communicated with the air intake port and disposed at upstream of the radiator.
COOLING FAN CONTROL METHOD FOR VEHICLE
A cooling fan control method for a vehicle is provided. The method includes turning on a starting of the vehicle and sensing a stack temperature. A first required speed of first and second cooling fans required by the stack radiator is set and a temperature of an electrical equipment is sensed to set a second required speed of the first cooling fan. When an air conditioner is operated; an air conditioner pressure is sensed and a second required speed of the second cooling fan required by the condenser is set. The method then compares the required speeds as well as a resonance frequency RPM to determine different setting conditions of the fans. The operation of the fans is complete when the coolant temperature and an air conditioner pressure of the stack and the electrical equipment are within a predetermined setting value.
SEMICONDUCTOR DEVICES INCLUDING STACKED SEMICONDUCTOR CHIPS
A semiconductor device includes a chip stack structure including a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a first substrate, a first circuit layer on a front surface of the first substrate, and a first connecting layer disposed on the first circuit layer and including a first metal pad electrically connected to the first circuit layer. The second semiconductor chip includes a second substrate, a second circuit layer on a front surface of the second substrate, and a second connecting layer disposed on the second circuit layer and including a second metal pad electrically connected to the second circuit layer. The first connecting layer faces the second connecting layer. The first and second metal pads are in contact with each other to couple the first and second semiconductor chips to each other.
Vehicle Air Conditioning Device
Vehicle air conditioning device comprising a bypass pipe which passes a radiator and an outdoor expansion valve, and opening/closing valves. A control device executes a heating mode to open solenoid valve 30 and close solenoid valve 40, and a dehumidifying and heating mode to close the solenoid valve 30, open solenoid valve 40, let a refrigerant radiate heat in outdoor heat exchanger 7, let the refrigerant absorb heat in heat absorber 9, and generate heat in auxiliary heater 23. When changing from the heating mode to the dehumidifying and heating mode, the control device sends the refrigerant to receiver drier portion 14, controls a compressor to reduce a difference between pressures before and after the solenoid valve 40, opens solenoid valve 40, closes solenoid valve 30, shuts off the outdoor expansion valve, and shifts the compressor to control in the dehumidifying and heating mode.
Semiconductor devices including stacked semiconductor chips
A semiconductor device includes a chip stack structure including a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a first substrate, a first circuit layer on a front surface of the first substrate, and a first connecting layer disposed on the first circuit layer and including a first metal pad electrically connected to the first circuit layer. The second semiconductor chip includes a second substrate, a second circuit layer on a front surface of the second substrate, and a second connecting layer disposed on the second circuit layer and including a second metal pad electrically connected to the second circuit layer. The first connecting layer faces the second connecting layer. The first and second metal pads are in contact with each other to couple the first and second semiconductor chips to each other.