A module clip piece for a module is disclosed. The module clip piece includes at least one protrusion configured to engage at least one groove of a first neighboring module clip piece. The at least one protrusion protrudes in a first direction. At least one groove is coupled to the at least one protrusion and is configured to engage at least one protrusion of a second neighboring module clip piece. The at least one groove extends in a second direction that is orthogonal to the first direction.

A system for containing electrochromic preforms comprising: a rigid structure defining a compartment; and a vapor barrier disposed within the compartment and adapted to define a selectively sealable internal volume, wherein a plurality of electrochromic preforms are receivable in the internal volume, and wherein the internal volume defines a reference tool for aligning at least one of the plurality of electrochromic preforms. A component adapted to couple with an edge of an electrochromic preform comprising: a body defining an electrochromic preform engagement portion and a tool engagement portion pivotally coupled with the electrochromic preform engagement portion, wherein reducing a dimension of the tool engagement portion increases a corresponding dimension in the electrochromic preform engagement portion.

A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of D.sub.max, where D.sub.max is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.

A device used in manufacturing for transportation of workpieces of different sizes includes a supporting part, the supporting part including a support plate and parallel and detachable separator plates mounted to the support plate. The support plate includes bottom, first side plate, second side plate, and connecting plate. First and second side plates are parallel and opposing, the connecting plate is connected therebetween. Each separator plate includes a main portion and a protruding first limiting portion. The first limiting portion of one separator plate abuts against the first side plate, and each first limiting portion of other separator plates abuts against the main portion of a neighboring separator plate. The gaps formed between the main portions of neighboring separator plates carry the workpieces being transported.

A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of D.sub.max, where D.sub.max is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.

Connectors, systems with connectors and processes with connectors are described. These include how connectors can actively hold external portions of two frames or other components together during transport and before final installation, as well as, how the connectors can be repositionable on the frame or other component so as to provide a mechanical connection in one position and not to provide a mechanical connection when moved into a second position. The connectors can also function to provide spacing or alignment or both between frames or other components grouped together using the connectors.

A system for containing electrochromic preforms comprising: a rigid structure defining a compartment; and a vapor barrier disposed within the compartment and adapted to define a selectively sealable internal volume, wherein a plurality of electrochromic preforms are receivable in the internal volume, and wherein the internal volume defines a reference tool for aligning at least one of the plurality of electrochromic preforms. A component adapted to couple with an edge of an electrochromic preform comprising: a body defining an electrochromic preform engagement portion and a tool engagement portion pivotally coupled with the electrochromic preform engagement portion, wherein reducing a dimension of the tool engagement portion increases a corresponding dimension in the electrochromic preform engagement portion.

A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of D.sub.max, where D.sub.max is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.

A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of D.sub.max, where D.sub.max is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.

A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of D.sub.max, where D.sub.max is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.