An adsorption device includes a magnetic plate and a limiting layer. A surface of the magnetic plate includes a first region and a plurality of second regions spaced apart from each other. The first region and each second region do not overlap with each other. The first region forms a magnetic pole of the magnetic plate, and each second region forms the opposite magnetic pole of the magnetic plate. The limiting layer covers the first region. Each second region is exposed to the limiting layer and configured for adsorbing a small-scale LED as a target object.

An adsorption device includes a magnetic plate and a limiting layer. A surface of the magnetic plate includes a first region and a plurality of second regions spaced apart from each other. The first region and each second region do not overlap with each other. The first region forms a magnetic pole of the magnetic plate, and each second region forms the opposite magnetic pole of the magnetic plate. The limiting layer covers the first region. Each second region is exposed to the limiting layer and configured for adsorbing a small-scale LED as a target object.

In one example, a substrate support for a processing chamber comprises a plurality of pins and a plurality of alignment elements. The plurality of pins are configured to mate with terminals of an electrostatic chuck. The plurality of pins are configured to be coupled to one or more power sources. The plurality of alignment elements are configured to interface with a plurality of centering elements of the electrostatic chuck to center the electrostatic chuck with the substrate support. Each of the plurality of alignment elements is configured to interface with a slot of a corresponding one of the plurality of centering elements.

In one example, a substrate support for a processing chamber comprises a plurality of pins and a plurality of alignment elements. The plurality of pins are configured to mate with terminals of an electrostatic chuck. The plurality of pins are configured to be coupled to one or more power sources. The plurality of alignment elements are configured to interface with a plurality of centering elements of the electrostatic chuck to center the electrostatic chuck with the substrate support. Each of the plurality of alignment elements is configured to interface with a slot of a corresponding one of the plurality of centering elements.

A pedestal assembly for a processing region and comprising first pins coupled to a substrate support, configured to mate with first terminals of an electrostatic chuck, and are configured to be coupled to a first power source. Each of the first pins comprises an interface element, and a compliance element supporting the interface element. Second pins are coupled to the substrate support, configured to mate with second terminals of the electrostatic chuck, and configured to couple to a second power source. Alignment elements are coupled to the substrate support and are configured to interface with centering elements of the electrostatic chuck. The flexible element is coupled to the substrate support, configured to interface with a passageway of the electrostatic chuck, and configured to be coupled to a gas source.

A pedestal assembly for a processing region and comprising first pins coupled to a substrate support, configured to mate with first terminals of an electrostatic chuck, and are configured to be coupled to a first power source. Each of the first pins comprises an interface element, and a compliance element supporting the interface element. Second pins are coupled to the substrate support, configured to mate with second terminals of the electrostatic chuck, and configured to couple to a second power source. Alignment elements are coupled to the substrate support and are configured to interface with centering elements of the electrostatic chuck. The flexible element is coupled to the substrate support, configured to interface with a passageway of the electrostatic chuck, and configured to be coupled to a gas source.

An electrostatic chuck includes electrodes to clamp a workpiece, electrodes to electrostatically levitate and position the workpiece, and sensors to detect position and orientation of the workpiece. Lateral motion of the workpiece relative to the electrostatic chuck can be damped prior to clamping.

An electrostatic chuck includes electrodes to clamp a workpiece, electrodes to electrostatically levitate and position the workpiece, and sensors to detect position and orientation of the workpiece. Lateral motion of the workpiece relative to the electrostatic chuck can be damped prior to clamping.

Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.

A substrate and a display panel using the substrate are disclosed. The substrate includes a base layer; a magnetic material layer on a side of the base layer; and a thin film transistor (TFT) array layer on a side of the magnetic material layer away from the base layer.