Present embodiments relate to a tie plate dispenser which aligns tie plates for dispensing based on rail base rather than outer edges of tie plate. Thus tie plates are aligned and located in a differing manner than prior art systems. Further, the tie plate dispenser includes an opening over which a magnet is disposed to retain a tie plate over the opening. The tie plate over the opening may be selectively released by disengaging the tie plate from the magnet.

The present disclosure provides a support device for conveying at least one solar cell element in a transport direction, wherein the support device comprises a support element configured for supporting the at least one solar cell element and an electric arrangement configured for providing an electrostatic force for holding the at least one solar cell element on the support element.

The present disclosure provides a support device for conveying at least one solar cell element in a transport direction, wherein the support device comprises a support element configured for supporting the at least one solar cell element and an electric arrangement configured for providing an electrostatic force for holding the at least one solar cell element on the support element.

The present disclosure relates to magnetic coupling devices. More specifically, the present disclosure relates to magnetic coupling devices configured to be linearly actuated and de-actuated.

A method for making an adsorption device includes: providing and etching a substrate to form a plurality of receiving grooves spaced apart from each other; forming a magnetic film in each of the plurality of receiving grooves; and forming a magnet in each of the plurality of receiving grooves. Each receiving groove includes a bottom wall and a side wall coupling the bottom wall. The magnetic film covers the bottom wall and the side wall of each of receiving groove.

A method for making an adsorption device includes: providing and etching a substrate to form a plurality of receiving grooves spaced apart from each other; forming a magnetic film in each of the plurality of receiving grooves; and forming a magnet in each of the plurality of receiving grooves. Each receiving groove includes a bottom wall and a side wall coupling the bottom wall. The magnetic film covers the bottom wall and the side wall of each of receiving groove.

A wafer coating device and a face-down type wafer carrying assembly thereof are provided. The face-down type wafer carrying assembly includes a magnetic force generating module, a temperature control module, and a magnetizable module. The temperature control module is adjacent to the magnetic force generating module. The magnetizable module is disposed on the temperature control module. The magnetizable module includes a high-temperature magnetizable metal plate disposed on the temperature control module. When at least one wafer is temporarily adhered to the adhesive bottom surface of the high-temperature adhesive layer, a prepared surface of the at least one wafer can face downwardly by adhering of the adhesive bottom surface of the high-temperature adhesive layer, so that the face-down type wafer carrying assembly can be applied to solve the problem that the prepared surface of the wafer would be dirtied by falling particles due to gravity.

A wafer coating device and a face-down type wafer carrying assembly thereof are provided. The face-down type wafer carrying assembly includes a magnetic force generating module, a temperature control module, and a magnetizable module. The temperature control module is adjacent to the magnetic force generating module. The magnetizable module is disposed on the temperature control module. The magnetizable module includes a high-temperature magnetizable metal plate disposed on the temperature control module. When at least one wafer is temporarily adhered to the adhesive bottom surface of the high-temperature adhesive layer, a prepared surface of the at least one wafer can face downwardly by adhering of the adhesive bottom surface of the high-temperature adhesive layer, so that the face-down type wafer carrying assembly can be applied to solve the problem that the prepared surface of the wafer would be dirtied by falling particles due to gravity.

Apparatus and methods for destacking objects are disclosed. An apparatus includes a robotic arm, and an end effector connected to the robotic arm. The end effector including a grasping element for grasping an object and means for clearing a surface of the object before the grasping element grasps the object at the surface. A method for mechanically destacking dishware involves moving an end effector near to a top dish in a stack of dishware, clearing an area on a surface of the top dish by sweeping a scraper bar of a scraper mechanism over the surface of the top dish in a first direction, wherein the scraper bar is mechanically connected to the end effector, and grasping, with a grasping element of the end effector, the top dish at the area on the surface of the top dish that has been cleared by the scraper.

Gripping group (1) for at least one tool (2) comprising at least one magnetizable material, said tool (2) being configured to be supported by at least one projecting shaft (3) of one storage and having one respective gripping face (21), facing one free end (32) of said projecting shaft (3), the gripping face delimiting at least one plurality of regions (211, 212, 203, 214), the gripping group (1) comprising: at least one gripping head (4) including: —at least one support element (40), having a first face (41) configured to be directed toward said gripping face (21); —at least two electromagnets (42; 421, 422, 423, 424, 425), supported by said at least one support element (40), at said first face (41) thereof, and placed thereon in such a way as to delimit at least one gripping plane (5) at exposed ends thereof configured to generate one respective magnetic field, wherein when said at least one gripping plane (5) is directed toward the gripping face (21) each one of the least two electromagnets (42; 421, 422, 423, 424, 425) is configured to be placed at one respective region (211, 212, 203, 214) of said gripping face (21) and to generate said respective magnetic field toward the respective region of said gripping face (21); —at least one data control and processing unit operatively connected to said at least two electromagnets (42; 421, 422, 423, 424, 425); characterised in that said at least one data control and processing unit is configured to selectively activate said at least two electromagnets (42; 421, 422, 423, 424, 425) by sending respective magnetization signals to generate said respective magnetic fields independently from one another.