A feeding system comprises a hopper having a discharge port at a bottom of the hopper, a flow control gate disposed at the discharge port of the hopper, a sliding rail obliquely disposed below the hopper, and a vibration excitation unit. The hopper accommodates a plurality of different types of product components and each of the product components flows out from the discharge port of the hopper. A flow rate of the product components flowing out from the discharge port is adjustable by adjusting an opening degree of the flow control gate. The sliding rail is configured to receive the product components flowing out from the discharge port. The vibration excitation unit receives the product components from the sliding rail and is configured to separate the product components and to change a posture of the product components by virtue of vibration.

Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations. In particular, some embodiments of the present technology determine the center locations of individual vias on a wafer and average them together to obtain an average center location of the set of vias. Based on a comparison of the average center location to a desired center location, the present technology adjusts the wafer position. Additionally, in some embodiments, the present technology compares wafer via patterns to a template and adjusts the position of the wafer based on the comparison.

Embodiments provide methods, systems, and apparatuses for loading workpieces in a flow direction into the spaced apart lugs on a lugged conveyor with the workpieces oriented transverse to the flow direction. The lug loader includes an array of pairs of endless conveyors configured to convey workpieces toward a lugged conveyor. The first and second endless conveyors of each pair are spaced laterally apart across the flow direction and aligned substantially in the flow direction. The array can form a continuous or discontinuous transport surface. Some pairs of endless conveyors in the array may overlap one or more other pairs of endless conveyors in the array. At least one pair of endless conveyors in the array may include two or more endless conveyors that are independently driven at different speeds and/or in different directions to de-skew a workpiece.

Embodiments provide methods, systems, and apparatuses for loading workpieces in a flow direction into the spaced apart lugs on a lugged conveyor with the workpieces oriented transverse to the flow direction. The lug loader includes an array of pairs of endless conveyors configured to convey workpieces toward a lugged conveyor. The first and second endless conveyors of each pair are spaced laterally apart across the flow direction and aligned substantially in the flow direction. The array can form a continuous or discontinuous transport surface. Some pairs of endless conveyors in the array may overlap one or more other pairs of endless conveyors in the array. At least one pair of endless conveyors in the array may include two or more endless conveyors that are independently driven at different speeds and/or in different directions to de-skew a workpiece.

Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations. In particular, some embodiments of the present technology determine the center locations of individual vias on a wafer and average them together to obtain an average center location of the set of vias. Based on a comparison of the average center location to a desired center location, the present technology adjusts the wafer position. Additionally, in some embodiments, the present technology compares wafer via patterns to a template and adjusts the position of the wafer based on the comparison.

A method for reorienting products includes providing one or more products in a first orientation on a surface; advancing the one or more products in the machine direction at a nominal advance rate; and retracting an end of the surface in a reverse machine direction at a nominal retract rate, such that the one or more products are advanced beyond said end into a landing region. Said end is disposed at a first elevation. The method further comprises deflecting a leading end of at least one product, such that the at least one product lands in a second orientation on a landing surface disposed in the landing region at a second elevation. The first orientation is different than the second orientation, and the first elevation is higher than the second elevation.

An automatic egg tray stacking apparatus turns alternate egg trays through the operation of movable guides at the junction with a loading conveyor before conveying the egg trays toward a stacking mechanism that first stops the egg tray and then lowers the stack on top of the egg tray before re-elevating the partially formed stack to permit the entrance of a new egg tray into the stacking mechanism. Once the stack of egg trays is completed, the stack is allowed to move onto a stack conveyor and is moved forwardly for shipment. The stacking mechanism is operated by a single actuator having dual pneumatic cylinders that provide a three position operation of the lifting function with the stacking mechanism having lifter members engaging all four sides of the lowermost egg tray of the elevated stack. A control mechanism operates the apparatus with input from appropriately positioned sensors.

Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations. In particular, some embodiments of the present technology determine the center locations of individual vias on a wafer and average them together to obtain an average center location of the set of vias. Based on a comparison of the average center location to a desired center location, the present technology adjusts the wafer position. Additionally, in some embodiments, the present technology compares wafer via patterns to a template and adjusts the position of the wafer based on the comparison.

A system, and associated method, for launching and delivering separated food product in organized groups to a robotized packaging station for the product. The system initiates the delivery via a metered hopper of food product delivering the product to a launch V-belt that aligns the product end to end. A successive singulator belt, positioned adjacent to and receiving product from the launch belt, further organizes the product into a single file alignment. An optional separator belt may follow the singulator belt to create gaps between successive product units. The product is then delivered to a pick belt for product to be provided to the packaging robot. The system product information is from a single (per product delivery line) sensor, enabling intergrated end-to-end control from hopper to robot, and a nearly continuous motion of said pick belt.

Provided is a produce pack arrangement system. The produce pack arrangement system comprises a produce supply station, a produce orientation and assembly station, and a produce packaging delivery station. The produce orientation and assembly station is configured to receive produce from the produce supply station and orient a set group of produce according to a desired predetermined arrangement prior to release to the produce packing delivery station.