An optical module includes a mirror unit and a beam splitter unit. The mirror unit includes a base with a main surface, a movable mirror, a first fixed mirror, and a drive unit. The beam splitter unit constitutes a first interference optical system for measurement light along with the movable mirror and the first fixed mirror. A mirror surface of the movable mirror and a mirror surface of the first fixed mirror follow a plane parallel to the main surface and face one side in a first direction perpendicular to the main surface. The movable mirror, the drive unit, and at least a part of an optical path between the beam splitter unit and the first fixed mirror are disposed in an airtight space.

The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

An optical module includes a mirror unit and a beam splitter unit. The mirror unit includes a base with a main surface, a movable mirror, a first fixed mirror, and a drive unit. The beam splitter unit constitutes a first interference optical system for measurement light along with the movable mirror and the first fixed mirror. A mirror surface of the movable mirror and a mirror surface of the first fixed mirror follow a plane parallel to the main surface and face one side in a first direction perpendicular to the main surface. The movable mirror, the drive unit, and at least a part of an optical path between the beam splitter unit and the first fixed mirror are disposed in an airtight space.

A micromechanical component for a sensor device including a substrate having a substrate surface, at least one stator electrode situated on the substrate surface and/or on the at least one intermediate layer covering at least partially the substrate surface, which is formed in each case from a first semiconductor and/or metal layer, at least one adjustably situated actuator electrode, which is formed in each case from a second semiconductor and/or metal layer, and a diaphragm spanning the at least one stator electrode and the at least one actuator electrode, including a diaphragm exterior side directed away from the at least one stator electrode, which is formed from a third semiconductor and/or metal layer, a stiffening and/or protective structure protruding at the diaphragm exterior side being formed from a fourth semiconductor and/or metal layer.

A fast steering optical mirror for laser beam deflection, moved by at least one rotational axis, including: a plate containing a plurality of carbon fiber layers laid up in a resin, wherein the plate includes a front face, at least a portion of the front face being polished and coated for laser light reflection; and wherein a surface normal of the front face is aligned orthogonal to the at least one rotational axis. A method of manufacturing fast steering optical mirror including: forming a plate having a front face and a back face by laying up a plurality of carbon fiber layers in a resin; aligning the plate so that a surface normal of the plate is orthogonal to at least one rotational axis of the mirror; and polishing and coating at least a portion of the front face for light reflection.

A MEMS capacitive microphone according to the present invention is configured such that a support plate 120 from which an inside thereof has been removed in a plane is attached to supports 110 each having an end fixed to a substrate 100, an anchor 130 is attached to an edge region of the support plate 120, an edge of a diaphragm 200 is supported by the anchor 130, and a “substrate-free area” includes the anchor 130 in a plan view, and pluralities of moving comb fingers 300 and stiffeners are attached to a top or bottom or a top and bottom of the diaphragm 200, and the supports 110 support the stationary comb fingers 400 arranged at predetermined intervals on both sides of the moving comb fingers 300 in a plan view.

A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.

For manufacturing an optical microelectromechanical device, a first wafer of semiconductor material having a first surface and a second surface is machined to form a suspended mirror structure, a fixed structure surrounding the suspended mirror structure, elastic supporting elements which extend between the fixed structure and the suspended mirror structure, and an actuation structure coupled to the suspended mirror structure. A second wafer is machined separately to form a chamber delimited by a bottom wall having a through opening. The second wafer is bonded to the first surface of the first wafer in such a way that the chamber overlies the actuation structure and the through opening is aligned to the suspended mirror structure. Furthermore, a third wafer is bonded to the second surface of the first wafer to form a composite wafer device. The composite wafer device is then diced to form an optical microelectromechanical device.

A method to create a multi-zone microstructure spring includes releasing a buckling layer from a substrate, wherein the buckling layer displaces into a curved shape after the releasing. The buckling layer is displaced, relative to the substrate, through at least one of a first zone, a second zone, and a third zone, wherein the buckling layer provides positive stiffness in the first zone, zero stiffness in a second zone, and negative stiffness in a third zone, and the buckling layer must pass through the first zone to reach the second zone and the buckling layer must pass through the second zone to reach the third zone. A multi-zone microstructure spring includes a substrate and a buckling layer. The buckling layer has a surface area. The buckling layer has a positive stiffness in a first zone, zero stiffness in a second zone, and a negative stiffness in a third zone. The buckling layer must pass through the first zone to reach the second zone and the buckling layer must pass through the second zone to reach the third zone. The buckling layer is connected to the substrate. The microstructure includes an elastic connection. The elastic connection is in contact with the buckling layer over a fraction of the buckling layer's surface area.

An optical module includes a mirror unit and a beam splitter unit. The mirror unit includes a base with a main surface, a movable mirror, a first fixed mirror, and a drive unit. The beam splitter unit constitutes a first interference optical system for measurement light along with the movable mirror and the first fixed mirror. A mirror surface of the movable mirror and a mirror surface of the first fixed mirror follow a plane parallel to the main surface and face one side in a first direction perpendicular to the main surface. The movable mirror, the drive unit, and at least a part of an optical path between the beam splitter unit and the first fixed mirror are disposed in an airtight space.