A microelectromechanical system (MEMS) device comprising a wafer including a MEMS device in a substrate of the wafer is mounted to a fluid dispenser stage. The MEMS device has a damping structure coupled to a suspended element and one or more fluid confinement structures. The suspended element is connected to a fixed part of the substrate by one or more flexures configured to permit movement of the suspended element relative to the fixed part of the substrate. The damping structure extends into a gap between the suspended element and fixed part of the substrate. The fluid confinement structures permit movement of the damping structure within a limited portion of the gap and confine a viscoelastic fluid to the limited portion of the gap. A viscoelastic fluid is deposited onto the wafer in an area of the wafer configured to communicate the viscoelastic fluid into the limited portion of the gap.

Low friction coating of the present invention includes a boron-doped zinc oxide thin film, wherein piezoelectric polarization in a vertical direction perpendicular to a film surface and a lateral direction horizontal to the film surface occurs and a magnitude of the piezoelectric polarization in the vertical direction is within 150 pm and a magnitude of the piezoelectric polarization in the lateral direction is within 100 pm at 90% or more of measurement points. This makes it possible to greatly decrease the friction in a nanometer order.

Microelectromechanical and/or nanoelectromechanical device comprising a fixed part (4), at least one suspended part (2) intended to be moveable in the plane of said device with respect to the fixed part (4) along at least one first direction (Y), a first means (6) for suspending said suspended part (2), said first suspension means (6) comprising two suspension elements (8.1, 8.2) each suspension element (8.1, 8.2) comprising a first end fixed directly to the suspended part (2) and a second end connected to the fixed part (4), each suspension element (8.1, 8.2) having a half-ellipse shape in the plane and extending between the first end and the second end, the two suspension elements (8.1, 8.2) being arranged with respect to each other so as to form an ellipse.

The present invention relates to a cantilever or membrane comprising a body and an elongated beam attached to the body. The elongated beam includes a first layer comprising a first material, a second layer comprising a second material having an elastic modulus different to that of the first material, a third layer comprising a third material having an elastic modulus different to that of the first material, where the first layer is sandwiched between the second layer and the third layer.

Provided herein is a method including forming a cavity in a first side of a first silicon wafer. An oxide layer is formed on the first side and in the cavity. The first side of the first silicon wafer is bonded to a first side of a second silicon wafer, and a gap control structure is deposited on a second side of the second silicon wafer. A MEMS structure is formed in the second silicon wafer. The second side of the second silicon wafer is eutecticly bonded to the third silicon wafer, and the eutectic bonding includes pressing the second silicon wafer to the third silicon wafer.

A MEMS device includes a fixed portion fixed to a pedestal, a movable portion arranged inside the fixed portion and configured to be displaceable with respect to the fixed portion, a connecting portion that connects the fixed portion and the movable portion, a piezoelectric element disposed on at least one of the fixed portion or the connecting portion, and a detection portion that output a signal corresponding to a distortion of the movable portion. A voltage is applied to the piezoelectric element on the basis of the output signal of the detection portion thereby reducing the distortion transmitted from the fixed portion to the movable portion.

A MEMS sensor includes a MEMS layer, a cap layer, and a substrate layer. The MEMS layer includes a suspended spring-mass system that moves in response to a sensed inertial force. The suspended spring-mass system is suspended from one or more anchors. The anchors are coupled to each of the cap layer and the substrate layer by anchoring components. The anchoring components are offset such that a force applied to the cap layer or the substrate layer causes a rotation of the anchor and such that the suspended spring-mass system substantially remains within the original MEMS layer.

An ultrasonic transducer includes a membrane, a bottom electrode, and a plurality of cavities disposed between the membrane and the bottom electrode, each of the plurality of cavities corresponding to an individual transducer cell. Portions of the bottom electrode corresponding to each individual transducer cell are electrically isolated from one another. Each portion of the bottom electrode corresponds to each individual transducer that cell further includes a first bottom electrode portion and a second bottom electrode portion, the first and second bottom electrode portions electrically isolated from one another.

The present invention generally relates to an RF MEMS DVC and a method for manufacture thereof. To ensure that undesired grain growth does not occur and contribute to an uneven RF electrode, a multilayer stack comprising an AlCu layer and a layer containing titanium may be used. The titanium diffuses into the AlCu layer at higher temperatures such that the grain growth of the AlCu will be inhibited and the switching element can be fabricated with a consistent structure, which leads to a consistent, predictable capacitance during operation.

At least one of a first beam portion and second beam portions is provided with an out-of-plane vibration suppressing structure configured to suppress vibration of a movable portion in an out-of-plane direction vertical to an in-plane direction. Thus, unintentional occurrence of unintentional movement in the out-of-plane direction vertical to the in-plane direction can be suppressed. Furthermore, in this case, a size reduction of a device can be achieved in comparison with a case where a device includes a motor disposed for rotation driving, for example.