A microelectromechanical systems (MEMS) package with high gettering efficiency is provided. A MEMS device is arranged over a logic chip, within a cavity that is hermetically sealed. A sensing electrode is arranged within the cavity, between the MEMS device and the logic chip. The sensing electrode is electrically coupled to the logic chip and is a conductive getter material configured to remove gas molecules from the cavity. A method for manufacturing the MEMS package is also provided.

In an electro-optic device, a chip provided with a mirror and a drive element adapted to drive the mirror, a cover having a light-transmitting property and adapted to cover the mirror in a planar view, and a spacer located between the cover and the chip are disposed on an interconnection board. Further, a boundary between the cover and the spacer, a boundary between the chip and the spacer, and a part of the interconnection board are covered with an inorganic film such as an aluminum oxide film. The inorganic film also covers a part of a chip-side terminal and an internal terminal, and a conductive member.

A micro-electro-mechanical pressure sensor device, formed by a cap region and by a sensor region of semiconductor material. An air gap extends between the sensor region and the cap region; a buried cavity extends underneath the air gap, in the sensor region, and delimits a membrane at the bottom. A through trench extends within the sensor region and laterally delimits a sensitive portion housing the membrane, a supporting portion, and a spring portion, the spring portion connecting the sensitive portion to the supporting portion. A channel extends within the spring portion and connects the buried cavity to a face of the second region. The first air gap is fluidically connected to the outside of the device, and the buried cavity is isolated from the outside via a sealing region arranged between the sensor region and the cap region.

A micro electro mechanical systems (MEMS) device includes a first electrode formed on a substrate, a second electrode that faces the first electrode, a protective film formed on the substrate with a space therebetween in which the first and second electrodes are located, and a sealing layer covering the protective film. The second electrode has a curved structure extending in a direction away from the first electrode, and is movable toward or away from the first electrode. The protective film has a plurality of openings formed therein and a protrusion that protrudes toward the second electrode.

A hermetic housing is disclosed (10a) for an optoelectronic component (11) or a MEMS device configured to form an enclosure (12) within which a low pressure or vacuum prevails. The hermetic housing includes: an optical window (14) transparent for at least one wavelength of interest (λ); and a layer of a getter material (15a) configured to capture gases present in said enclosure and deposited on the optical window opposite the enclosure. This layer of getter material has a thickness (e_t), greater than 60 nanometers, and a porosity (P) in the range from 10 to 70% to satisfy the following relation: (1−P)*e_t<λ/2πk with λ corresponding to the at least one wavelength of interest, and k corresponding to the extinction coefficient of the material of the layer of getter material for the at least one wavelength of interest of the optical window.

An electronic device comprises a “waterproof” package including a substrate of an organic material permeable to humidity and/or moisture as well as one or more electronic components arranged on the substrate. The substrate comprises a barrier layer capable of countering penetration of humidity and/or moisture into the package through the organic material substrate.

Various embodiments of the present disclosure are directed towards a method to roughen a crystalline layer. A crystalline layer is deposited over a substrate. A mask material is diffused into the crystalline layer along grain boundaries of the crystalline layer. The crystalline layer and the mask material may, for example, respectively be or comprise polysilicon and silicon oxide. Other suitable materials are, however, amenable. An etch is performed into the crystalline layer with an etchant having a high selectivity for the crystalline layer relative to the mask material. The mask material defines micro masks embedded in the crystalline layer along the grain boundaries. The micro masks protect underlying portions of the crystalline layer during the etch, such that the etch forms trenches in the crystalline layer where unmasked by the micro masks.

A structure and a formation method of a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a cap substrate and a MEMS substrate bonded with the cap substrate. The MEMS substrate includes a first movable element and a second movable element. The MEMS device also includes a first enclosed space surrounded by the MEMS substrate and the cap substrate, and the first movable element is in the first enclosed space. The MEMS device further includes a second enclosed space surrounded by the MEMS substrate and the cap substrate, and the second movable element is in the second enclosed space. In addition, the MEMS device includes a pressure-changing layer in the first enclosed space.

A protective cover member includes a laminate including: a protective membrane having a shape configured to cover an opening when the protective cover member is placed on the face of an object; a substrate film joined to the protective membrane; and a first adhesive layer configured to fix the protective cover member to the face, wherein an outer peripheral surface of the protective cover member has a step in a laminating direction of the laminate, a first portion of the protective cover member protrudes at the step more outward than a second portion of the protective cover member does when the protective cover member is placed on the face, the first portion being positioned farther from the face than the step, the second portion being positioned closer to the face than the step, and the protective membrane and the substrate film are positioned in the first portion.

A pressure sensor includes a silicon substrate which has a diaphragm, a frame-shaped side wall section which is placed on one surface side of the silicon substrate so as to surround the diaphragm in a plan view, a lid section which is placed so as to cover an opening of the side wall section and has a through-hole communicating inside and outside the side wall section, a sealing section which is placed on the lid section and seals the through-hole, and a pressure reference chamber which is defined by the silicon substrate, the side wall section, the lid section, and the sealing section, wherein a surface facing the pressure reference chamber of each of the side wall section and the lid section contains a silicon material.